Patents by Inventor Mark Richard Burdick

Mark Richard Burdick has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic module with conductively heat-sunk components
    Patent number: 5999407
    Abstract: A heat transfer arrangement for one or more heat-generating components (18a) on a printed-circuit board (16) includes a heat transfer plate (316) defining an aperture (416) registered with the components. A "vertically" movable heatsink adapter (410) is adjusted to juxtapose its "lower" surface with the "upper" surface of the components to be heat-sunk. A heat-transfer pad (318) may be used between the heatsink adapter (410) and the component (18a). In various embodiments, the heatsink adapter takes the form of circular (410) or rectangular (410R) plugs, a draw-tube (808) arrangement, or a bellows (1010).
    Type: Grant
    Filed: October 22, 1998
    Date of Patent: December 7, 1999
    Assignee: Lockheed Martin Corp.
    Inventors: Stephan John Meschter, Gary Miller, Mark Richard Burdick, Joseph Edward Kane