Abstract: Systems and methods in accordance with embodiments of the invention implement optical systems incorporating lens elements formed separately and subsequently bonded to low coefficient of thermal expansion substrates. Optical systems in accordance with various embodiments of the invention can be utilized in single aperture cameras, and multiple-aperture array cameras. In one embodiment, a robust optical system includes at least one carrier characterized by a low coefficient of thermal expansion to which at least a primary lens element formed from precision molded glass is bonded.

Abstract: A modular fluid characterisation system is provided. The modular fluid characterisation system includes a sampling unit containing optional pre-processing units to condition samples, and a valve network to distribute samples to one or more characterisation modules. Each characterisation module includes one or more instruments for characterising samples, and optional additional pre-processing units. Characterising modules can be added or removed depending on operational requirements. Sample flows are controlled in accordance with an automated characterisation program, and resulting characterisation may be obtained on the basis of a combination of results from different characterisation modules with regard to the characterisation program.

Abstract: Systems and methods in accordance with embodiments of the invention implement optical systems incorporating lens elements formed separately and subsequently bonded to low coefficient of thermal expansion substrates. Optical systems in accordance with various embodiments of the invention can be utilized in single aperture cameras, and multiple-aperture array cameras. In one embodiment, a robust optical system includes at least one carrier characterized by a low coefficient of thermal expansion to which at least a primary lens element formed from precision molded glass is bonded.

Abstract: Array cameras, and array camera modules incorporating independently aligned lens stacks are disclosed. Processes for manufacturing array camera modules including independently aligned lens stacks can include: forming at least one hole in at least one carrier; mounting the at least one carrier relative to at least one sensor so that light passing through the at least one hole in the at least one carrier is incident on a plurality of focal planes formed by arrays of pixels on the at least one sensor; and independently mounting a plurality of lens barrels to the at least one carrier, so that a lens stack in each lens barrel directs light through the at least one hole in the at least one carrier and focuses the light onto one of the plurality of focal planes.

Abstract: Array cameras, and array camera modules incorporating independently aligned lens stacks are disclosed. Processes for manufacturing array camera modules including independently aligned lens stacks can include: forming at least one hole in at least one carrier; mounting the at least one carrier relative to at least one sensor so that light passing through the at least one hole in the at least one carrier is incident on a plurality of focal planes formed by arrays of pixels on the at least one sensor; and independently mounting a plurality of lens barrels to the at least one carrier, so that a lens stack in each lens barrel directs light through the at least one hole in the at least one carrier and focuses the light onto one of the plurality of focal planes.

Abstract: Systems and methods in accordance with embodiments of the invention implement array cameras and array camera modules that have spectral filters disposed outside of constituent image sensors. In one embodiment, an array camera module includes: a lens stack array including lens elements arranged to form a plurality of optical channels, each optical channel including a field-of-view that is shifted with respect to the fields-of-views of each other optical channel so that each shift includes a sub-pixel shifted view of the scene, a glass substrate located within an optical channel, and a spectral filter disposed within, or else proximate to, a glass substrate within the lens stack array; and an imager array including a plurality of focal planes, where each focal plane includes a plurality of rows of pixels that also form a plurality of columns of pixels, and where each focal plane does not include pixels from another focal plane.

Abstract: Array cameras, and array camera modules incorporating independently aligned lens stacks are disclosed. Processes for manufacturing array camera modules including independently aligned lens stacks can include: forming at least one hole in at least one carrier; mounting the at least one carrier relative to at least one sensor so that light passing through the at least one hole in the at least one carrier is incident on a plurality of focal planes formed by arrays of pixels on the at least one sensor; and independently mounting a plurality of lens barrels to the at least one carrier, so that a lens stack in each lens barrel directs light through the at least one hole in the at least one carrier and focuses the light onto one of the plurality of focal planes.

Abstract: Array cameras, and array camera modules incorporating independently aligned lens stacks are disclosed. Processes for manufacturing array camera modules including independently aligned lens stacks can include: forming at least one hole in at least one carrier; mounting the at least one carrier relative to at least one sensor so that light passing through the at least one hole in the at least one carrier is incident on a plurality of focal planes formed by arrays of pixels on the at least one sensor; and independently mounting a plurality of lens barrels to the at least one carrier, so that a lens stack in each lens barrel directs light through the at least one hole in the at least one carrier and focuses the light onto one of the plurality of focal planes.

Abstract: Systems and methods in accordance with embodiments of the invention implement array cameras and array camera modules that have spectral filters disposed outside of constituent image sensors. In one embodiment, an array camera module includes: a lens stack array including lens elements arranged to form a plurality of optical channels, each optical channel including a field-of-view that is shifted with respect to the fields-of-views of each other optical channel so that each shift includes a sub-pixel shifted view of the scene, a glass substrate located within an optical channel, and a spectral filter disposed within, or else proximate to, a glass substrate within the lens stack array; and an imager array including a plurality of focal planes, where each focal plane includes a plurality of rows of pixels that also form a plurality of columns of pixels, and where each focal plane does not include pixels from another focal plane.

Abstract: Array cameras, and array camera modules incorporating independently aligned lens stacks are disclosed. Processes for manufacturing array camera modules including independently aligned lens stacks can include: forming at least one hole in at least one carrier; mounting the at least one carrier relative to at least one sensor so that light passing through the at least one hole in the at least one carrier is incident on a plurality of focal planes formed by arrays of pixels on the at least one sensor; and independently mounting a plurality of lens barrels to the at least one carrier, so that a lens stack in each lens barrel directs light through the at least one hole in the at least one carrier and focuses the light onto one of the plurality of focal planes.

Abstract: Array cameras, and array camera modules incorporating independently aligned lens stacks are disclosed. Processes for manufacturing array camera modules including independently aligned lens stacks can include: forming at least one hole in at least one carrier; mounting the at least one carrier relative to at least one sensor so that light passing through the at least one hole in the at least one carrier is incident on a plurality of focal planes formed by arrays of pixels on the at least one sensor; and independently mounting a plurality of lens barrels to the at least one carrier, so that a lens stack in each lens barrel directs light through the at least one hole in the at least one carrier and focuses the light onto one of the plurality of focal planes.

Abstract: Array cameras, and array camera modules incorporating independently aligned lens stacks are disclosed. Processes for manufacturing array camera modules including independently aligned lens stacks can include: forming at least one hole in at least one carrier; mounting the at least one carrier relative to at least one sensor so that light passing through the at least one hole in the at least one carrier is incident on a plurality of focal planes formed by arrays of pixels on the at least one sensor; and independently mounting a plurality of lens barrels to the at least one carrier, so that a lens stack in each lens barrel directs light through the at least one hole in the at least one carrier and focuses the light onto one of the plurality of focal planes.

Abstract: Array cameras, and array camera modules incorporating independently aligned lens stacks are disclosed. Processes for manufacturing array camera modules including independently aligned lens stacks can include: forming at least one hole in at least one carrier; mounting the at least one carrier relative to at least one sensor so that light passing through the at least one hole in the at least one carrier is incident on a plurality of focal planes formed by arrays of pixels on the at least one sensor; and independently mounting a plurality of lens barrels to the at least one carrier, so that a lens stack in each lens barrel directs light through the at least one hole in the at least one carrier and focuses the light onto one of the plurality of focal planes.

Abstract: A composite magnet wire includes, in an exemplary embodiment, a metal wire and a coating applied to an outer surface of the wire. The coating includes a polyimide polymer and a plurality of alumina nano particles dispersed in the polyimide polymer. The alumina nano particles have a surface treatment applied to outer surfaces of the alumina nano particles, where the surface treatment includes a phenyl-silane. The composite magnet wire has a thermal degradation temperature index of at least 300° C. as calculated in accordance with ASTM E1641 or D2307.

Abstract: A composite magnet wire includes, in an exemplary embodiment, a metal wire and a coating applied to an outer surface of the wire. The coating includes a polyimide polymer and a plurality of alumina nano particles dispersed in the polyimide polymer. The alumina nano particles have a surface treatment applied to outer surfaces of the alumina nano particles, where the surface treatment includes a phenyl-silane. The composite magnet wire has a thermal degradation temperature index of at least 300° C. as calculated in accordance with ASTM E1641 or D2307.