Abstract: A flexible barrier assembly having a flexible visible light-transmissive substrate having a Tg greater than or equal to that of heat-stabilized polyethylene terephthalate (“HSPET”) overcoated with a first polymer layer having a Tg greater than or equal to that of HSPET and further overcoated with at least two visible light-transmissive inorganic barrier layers separated by at least one second polymer layer having a Tg greater than or equal to that of HSPET can be used to mount, cover, encapsulate or form moisture- and oxygen-sensitive articles such as organic light emitting devices and light valves.

Abstract: Color shifting retroreflective articles can provide features such as decorative effects, evidence of tampering, security authentication or positional information. In some embodiments, the color shifting retroreflective article includes a layer of microspheres, and a reflective coating that is disposed in optical association with the layer of microspheres. The reflective coating includes a spacer layer disposed between a semitransparent first reflective layer and a second reflective layer. The first reflective layer includes a reflective layer disposed adjacent the layer of microspheres. At least one layer of the reflective coating includes a non-uniform thickness associated with each of a plurality of microspheres such that light incident on the article from a first direction is retroreflected at a first color and light incident on the article from a second direction is retroreflected at a second color visibly different from the first color.

Abstract: The present invention provides a material for packaging electronic components. In one embodiment, the packaging material comprises (a) a puncture resistant film having opposed first and second major surfaces; (b) a substantially continuous metal free light transmissible layer disposed on the first surface of the puncture resistant film, wherein the light transmissible layer comprises at least one pair of polymer layer and transparent conductive oxide layer; and (c) a heat sealable layer disposed on the light transmissible layer or on the second surface of the puncture resistant film. Other embodiments are provided.