Patents by Inventor Mark Roesch

Mark Roesch has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6198045
    Abstract: The invention relates to the use of drill-pointed screws to attach electrical boxes to heavy gauge metal studs. The drill-pointed screws of the invention are at least two inches long and have a length to thread diameter ratio of at least 12 to 1. The electrical boxes of the invention have brackets that form a relatively steep angle to the stud, such a steep angle having proven necessary to get the drill-pointed screws to penetrate the metal. The electrical boxes may also include a second set of brackets that angle more shallow angle with the stud surface and are more suitable for use with nails. The electrical boxes are preferable made of extra-thick relatively shatter resistant engineered plastic and are preferably formed so that they can be vertically stacked in a nested fashion.
    Type: Grant
    Filed: June 18, 1999
    Date of Patent: March 6, 2001
    Assignee: The Lamson & Sessions Co.
    Inventor: Mark A. Roesch
  • Patent number: 6004417
    Abstract: A microencapsulatable solvent adhesive composition for coupling plastic conduits, such as pipes, connectors and related fittings comprises a water-insoluble polymer and a mixture of volatile organic solvents for the polymer, each of the solvents having 6 to 40 carbon atoms. This solvent adhesive composition is suitable for microencapsulation by aqueous-based microencapsulation processes. A plurality of microcapsules encapsulating the solvent adhesive composition are bound to a polymeric surface of a conduit, such as a pipe connector or fitting, by a binder composition, to form a surface coated with a layer of rupturable microcapsules. When the microcapsules are ruptured upon joining of the coated conduit to a second conduit, the volume of the released solvent adhesive composition is sufficient to cement the surfaces together.
    Type: Grant
    Filed: January 20, 1998
    Date of Patent: December 21, 1999
    Assignee: The Lamson & Sessions Co.
    Inventors: Mark A. Roesch, David A. Maccarone, Gary F. Hillenbrand, Morris F. Newsom, Roland M. Lynch
  • Patent number: 5922798
    Abstract: A microencapsulatable solvent adhesive composition for coupling plastic conduits, such as pipes, connectors and related fittings comprises a water-insoluble polymer and a mixture of volatile organic solvents for the polymer, each of the solvents having 6 to 40 carbon atoms. This solvent adhesive composition is suitable for microencapsulation by aqueous-based microencapsulation processes. A plurality of microcapsules encapsulating the solvent adhesive composition are bound to a polymeric surface of a conduit, such as a pipe connector or fitting, by a binder composition, to form a surface coated with a layer of rupturable microcapsules. When the microcapsules are ruptured upon joining of the coated conduit to a second conduit, the volume of the released solvent adhesive composition is sufficient to cement the surfaces together.
    Type: Grant
    Filed: January 20, 1998
    Date of Patent: July 13, 1999
    Assignee: The Lamson & Sessions Co.
    Inventors: Mark A. Roesch, David A. Maccarone, Gary F. Hillenbrand, Morris F. Newsom
  • Patent number: 5877236
    Abstract: A microencapsulatable solvent adhesive composition for coupling plastic conduits, such as pipes, connectors and related fittings comprises a water-insoluble polymer and a mixture of volatile organic solvents for the polymer, each of the solvents having 6 to 40 carbon atoms. This solvent adhesive composition is suitable for microencapsulation by aqueous-based microencapsulation processes. A plurality of microcapsules encapsulating the solvent adhesive composition are bound to a polymeric surface of a conduit, such as a pipe connector or fitting, by a binder composition, to form a surface coated with a layer of rupturable microcapsules. When the microcapsules are ruptured upon joining of the coated conduit to a second conduit, the volume of the released solvent adhesive composition is sufficient to cement the surfaces together.
    Type: Grant
    Filed: January 20, 1998
    Date of Patent: March 2, 1999
    Assignee: The Lamson & Sessions Co.
    Inventors: Mark A. Roesch, David A. Maccarone, Gary F. Hillenbrand, Morris F. Newsom, Roland M. Lynch
  • Patent number: 5824724
    Abstract: A microencapsulatable solvent adhesive composition for coupling plastic conduits, such as pipes, connectors and related fittings comprises a water-insoluble polymer and a mixture of volatile organic solvents for the polymer, each of the solvents having 6 to 40 carbon atoms. This solvent adhesive composition is suitable for microencapsulation by aqueous-based microencapsulation processes. A plurality of microcapsules encapsulating the solvent adhesive composition are bound to a polymeric surface of a conduit, such as a pipe connector or fitting, by a binder composition, to form a surface coated with a layer of rupturable microcapsules. When the microcapsules are ruptured upon joining of the coated conduit to a second conduit, the volume of the released solvent adhesive composition is sufficient to cement the surfaces together.
    Type: Grant
    Filed: January 20, 1998
    Date of Patent: October 20, 1998
    Assignee: The Lamson & Sessions Co.
    Inventors: Mark A. Roesch, David A. Maccarone, Gary F. Hillenbrand, Morris F. Newsom, Roland M. Lynch
  • Patent number: 5821293
    Abstract: A microencapsulatable solvent adhesive composition for coupling plastic conduits, such as pipes, connectors and related fittings comprises a water-insoluble polymer and a mixture of volatile organic solvents for the polymer, each of the solvents having 6 to 40 carbon atoms. This solvent adhesive composition is suitable for microencapsulation by aqueous-based microencapsulation processes. A plurality of microcapsules encapsulating the solvent adhesive composition are bound to a polymeric surface of a conduit, such as a pipe connector or fitting, by a binder composition, to form a surface coated with a layer of rupturable microcapsules. When the microcapsules are ruptured upon joining of the coated conduit to a second conduit, the volume of the released solvent adhesive composition is sufficient to cement the surfaces together.
    Type: Grant
    Filed: October 29, 1996
    Date of Patent: October 13, 1998
    Assignee: The Lamson & Sessions Co.
    Inventors: Mark A. Roesch, David A. Maccarone, Gary F. Hillenbrand, Morris F. Newsom, Roland M. Lynch
  • Patent number: 5522577
    Abstract: A mounting assembly for supporting a ceiling fan from a ceiling includes a support beam located inwardly of the ceiling surface at least a distance t. An electrical box having a bottom wall is directly joined to and supported from said support beam. The box has side walls extending from the bottom wall through the ceiling substantially to the exposed ceiling surface and terminating in an open end. A rigid metal plate or disk member adapted for supporting and mounting a ceiling fan is positioned over the open end of the box. The disk member is of a size sufficient to have a peripheral portion extending radially beyond the side walls of the box; and, a plurality of mounting screws extend from the metal disk member through the interior of the box into connected engagement with the beam for supporting the disk member from the beam without reliance on the electrical box.
    Type: Grant
    Filed: June 13, 1994
    Date of Patent: June 4, 1996
    Assignee: The Lamson & Sessions Co.
    Inventor: Mark Roesch
  • Patent number: D418210
    Type: Grant
    Filed: September 1, 1998
    Date of Patent: December 28, 1999
    Assignee: The Lamson & Sessions Co.
    Inventor: Mark A. Roesch
  • Patent number: D422266
    Type: Grant
    Filed: July 13, 1999
    Date of Patent: April 4, 2000
    Assignee: The Lamson & Sessions Co.
    Inventor: Mark A. Roesch