Abstract: The present disclosure relates to non-planar inductive electrical elements in semiconductor package lead frames. A non-planar inductive element is formed from a lead frame in a semiconductor package. The semiconductor package also includes at least one semiconductor die coupled to the lead frame. The non-planar inductive element could be formed by deforming portions of a patterned planar lead frame blank to form the non-planar inductive element in a deformed lead frame blank. The deformed lead frame blank and the at least one semiconductor die could then be packaged into a semiconductor package. A setting tool could be used to deform the lead frame blank. A configurable lead frame blank could be configurable into any of a variety of inductive elements, through interconnection of lead frame segments using wire bonds, for example.

Abstract: The present disclosure relates to non-planar inductive electrical elements in semiconductor package lead frames. A non-planar inductive element is formed from a lead frame in a semiconductor package. The semiconductor package also includes at least one semiconductor die coupled to the lead frame. The non-planar inductive element could be formed by deforming portions of a patterned planar lead frame blank to form the non-planar inductive element in a deformed lead frame blank. The deformed lead frame blank and the at least one semiconductor die could then be packaged into a semiconductor package. A setting tool could be used to deform the lead frame blank. A configurable lead frame blank could be configurable into any of a variety of inductive elements, through interconnection of lead frame segments using wire bonds, for example.

Abstract: A stacked backplane assembly, including two or more backplanes or midplanes having different functionality and combined together so as to form an integral unit, is provided. The backplanes forming the assembly are manufactured with prime and secondary manufacturing holes to enable alignment, so that the resulting tolerance build-up of the assembly is similar to that of a single backplane. Connectors can be arranged on the backplanes of the assembly so that an electronic or optical card can be simultaneously plugged in to one or more of the backplanes that comprise the stacked backplane assembly. The stacked backplane assembly of the embodiments of the invention is illustrated by having power and signal backplanes and midplanes, but can be equally applied to backplanes that provide other types of functionality.

Abstract: An interconnection module for holding and interconnecting optoelectronic cards is provided. It includes an optical midplane which accommodates and flexibly interconnects N optoelectronic cards on one side of the midplane and M cards on the other side of the midplane. Optical connectors, which are arranged on the midplane and on the cards, provide arrangement of cards on the midplane in one of the two positions, in the first position the cards on opposite sides of the midplane being parallel to each other, and in the second position the cards being perpendicular to each other. Preferably, each of the N cards on one side is connected to a subset of cards on the other side, the number of cards in the subset being variable for each of the N cards and less or equal to M in total. Additionally, a backplane section of the module, having a plurality of connectors joined via laminated strands, may be added as an extension of the midplane to interconnect any required number of cards on same side of the midplane.

Abstract: A stacked backplane assembly, including two or more backplanes or midplanes having different functionality and combined together so as to form an integral unit, is provided. The backplanes forming the assembly are manufactured with prime and secondary manufacturing holes to enable alignment, so that the resulting tolerance build-up of the assembly is similar to that of a single backplane. Connectors can be arranged on the backplanes of the assembly so that an electronic or optical card can be simultaneously plugged in to one or more of the backplanes that comprise the stacked backplane assembly. The stacked backplane assembly of the embodiments of the invention is illustrated by having power and signal backplanes and midplanes, but can be equally applied to backplanes that provide other types of functionality.

Abstract: An interconnection module for holding and interconnecting optoelectronic cards is provided. It includes an optical midplane which accommodates and flexibly interconnects N optoelectronic cards on one side of the midplane and M cards on the other side of the midplane. Optical connectors, which are arranged on the midplane and on the cards, provide arrangement of cards on the midplane in one of the two positions, in the first position the cards on opposite sides of the midplane being parallel to each other, and in the second position the cards being perpendicular to each other. Preferably, each of the N cards on one side is connected to a subset of cards on the other side, the number of cards in the subset being variable for each of the N cards and less or equal to M in total. Additionally, a backplane section of the module, having a plurality of connectors joined via laminated strands, may be added as an extension of the midplane to interconnect any required number of cards on same side of the midplane.

Abstract: A flexible integrated circuit package for mounting on a substrate is disclosed. The package consists of a tape film having layers of dielectric and conductive material, a semiconductor die and an array of conductive leads. A molded body covers the die, and absorbs the majority of the pressure applied when compressing the package between a heatsink and a printed circuit board (PCB). Rigid removable support material surrounds the molded body to keep the package flat while it is being mounted to the PCB. The support material is removed after soldering of the package to the PCB. The invention permits the package to be tightly compressed between a heatsink and a substrate without causing degradation of the conductive connections. Reliability of the connections is further increased since the tape film is flexible enough to accommodate bending of the substrate to which the package is connected.