Abstract: A system according to one embodiment includes a plurality of antennas configured on a conformal material, the conformal material capable of conforming to a contour of a platform; and driver circuitry coupled to each of the plurality of antennas, wherein the driver circuitry comprises a plurality of transceivers, the plurality of transceivers configured to provide independently adjustable phase delay in the coupling to each of the plurality of antennas.

Abstract: Disclosed are integration approaches for mm-wave array type architectures using multilayer substrate technologies. For instance, an apparatus may include a first substrate layer, a second substrate layer, and a third substrate layer. The first substrate layer has a first plurality of array elements, and the second substrate layer has a second plurality of array elements. The third substrate layer has an integrated circuit to exchange one or more radio frequency (RF) signals with the first and second pluralities of array elements. The first and second substrate layers are separated by approximately a half wavelength (?/2) corresponding to the one or more RF signals.

Abstract: Embodiments of wireless antenna array systems to achieve three-dimensional beam coverage are described herein. Disclosed is an integrated multiple phased antenna array on a flexible substrate with one RFIC. In this way the module can be molded onto the contour of a platform such as a notebook or a hub of the personal area network or local area network. The multiple phased array can be 3D bent in a compact size to fit into thin mobile platforms. Different array antennas or antennas radiate in different spherical directions with beam scanning capabilities while driven simultaneously by one RFIC chip.

Abstract: Disclosed are integration approaches for mm-wave array type architectures using multilayer substrate technologies. For instance, an apparatus may include a first substrate layer, a second substrate layer, and a third substrate layer. The first substrate layer has a first plurality of array elements, and the second substrate layer has a second plurality of array elements. The third substrate layer has an integrated circuit to exchange one or more radio frequency (RF) signals with the first and second pluralities of array elements. The first and second substrate layers are separated by approximately a half wavelength (?/2) corresponding to the one or more RF signals.

Abstract: An integrated CMOS power amplifier system to improve amplifier performance, the integrated CMOS power amplifier system including a plurality of differential main amplifier cores, a plurality of ground pads, and a plurality of routes to connect the plurality of differential main amplifier cores to the plurality of ground pads. Each differential main amplifier core includes a pair of collocated main amplifier core transistors. Each ground pad is connected to a subset of the differential main amplifier cores. Embodiments of the integrated CMOS power amplifier system decrease parasitic inductance to ground and increase the transconductance and amplification of the integrated CMOS power amplifier system, thus improving performance.

Abstract: An integrated CMOS power amplifier system to improve amplifier performance, the integrated CMOS power amplifier system including a plurality of differential main amplifier cores, a plurality of ground pads, and a plurality of routes to connect the plurality of differential main amplifier cores to the plurality of ground pads. Each differential main amplifier core includes a pair of collocated main amplifier core transistors. Each ground pad is connected to a subset of the differential main amplifier cores. Embodiments of the integrated CMOS power amplifier system decrease parasitic inductance to ground and increase the transconductance and amplification of the integrated CMOS power amplifier system, thus improving performance.