Abstract: Methods, apparatus, and systems for implementing a link layer retry protocol utilizing implicit ACKnowledgements (ACKs). Peer link interfaces are configured to facilitate confirmed error-free delivery of link-layer packets through use of implicit ACKs, while also providing retransmission of packets for which errors are detected and guaranteeing the link control data is either successfully received or data transfer over the link is prevented. In conjunction with transmitting packets, reliable packets are copied into sequential slots in a replay buffer. Each link interface tracks the slot at which each reliable packet is buffered, and in response to detection of an error, a retry request is sent to the transmit-side to retransmit the errant packet. The previously buffered copy of the errant packet is retrieved from the replay buffer and retransmitted.

Abstract: Method, apparatus, and systems for detecting lane errors and removing errant lanes in multi-lane links. Data comprising link packets is split into a plurality of bitstreams and transmitted over respective lanes of a multi-lane link in parallel. The bitstream data is received at multiple receive lanes of a receiver port and processed to reassemble link packets and to calculate a CRC over the data received on each lane. The link packets include a transmitted CRC that is compared to a received CRC to detect link packet errors. Upon detection of a link packet error, per-lane or per transfer group CRC values are stored, and a retry request is issued to retransmit the bad packet. In conjunction with receipt of the retransmitted packet, per-lane or per transfer group CRC values are recalculated over the received data and compared with the stored per-lane or per transfer group CRC values to detect the lane causing the link packet error.

Abstract: Method, apparatus, and systems for Link Transfer, bit error detection and link retry using flit bundles asynchronous to link Fabric Packets. A first type of packet comprising a Fabric Packet is generated and its data content is divided into multiple data units called “flits.” The flits are then bundled into a second type of packet comprising Link Transfer Packets (LTPs). The LTPs are then sent over single link segments in a fabric comprising many point-to-point links. Each LTP includes a CRC that is used to ensure that data transmitted over each link segment is error free, and comprises a unit of retransmission. The size of the fabric packets may vary, and they may be larger or smaller than an LTP. The transfer scheme enabled flits from multiple fabric packets to be bundled into a single LTP. Upon receipt at a fabric endpoint, the flits from the LTPs are extracted and reassembled to regenerate the Fabric Packets.

Abstract: A method includes specifying a first set of interconnected devices associated with a first leaf cell in Verilog syntax, and specifying a second set of interconnected devices associated with a second leaf cell in Verilog syntax. A connection between the first leaf cell and the second leaf cell is also specified in Verilog syntax. This specifies a circuit. The functionality of the logic can be tested by running a logic simulation on the circuit without converting to Verilog syntax. The Verilog syntax, associated with the circuit, can be converted directly from Verilog syntax to a SPICE netlist. The SPICE netlist can be used to simulate the timing and other parameters of the circuit. The Verilog syntax can be used to verify the circuit. Also included are a computer readable medium including an instruction set for the above method, and a data structure necessary to carry out the above method.

Abstract: Systems and methods for independently adjusting a duty cycle of an input clock signal in an IC to compensate for uncertainties and distortions in the logic signals resulting from the logic signals propagating through the IC to improve system performance. This is accomplished by inputting first and second programming instructions into one of a plurality of edge-triggered circuits to select one of a series of plurality of incremental or decremental duty cycle adjust circuits to adjust the duty cycle of a clock signal as a function of the first and second programming instructions.

Abstract: Systems and methods for synchronizing a system clock signal with a reference clock signal having a reduced phased offset to improve operating speeds of integrated circuits. This is accomplished by generating delayed system and reference clock signals by using the system and reference clock signals. The generated delayed clock signals are then monitored to determine the arrival of the raising and falling edges of the delayed clock signals. The system clock signal is then compensated based on the determination of the arrival of the delayed clock signals to substantially synchronize the system clock signal with respect to the reference clock signal.

Abstract: The present invention provides a system for efficient, high speed, high bandwidth, digital communication where transmit distances are greater than a single clock period. The digital system operates based on a system clock. Within the digital system a transmit module transmits data along with a capture clock signal to a receive module where the transmission time between the modules is greater than one period of the system clock. The capture clock operates in a known relationship to the system clock at a frequency at least twice as slow as the system clock. The digital system also has a synchronizing clock that operates at the same frequency as the forwarded clock. When the data arrives at the receive module it is captured by a pair of memory devices operating on different phases of the capture clock. The memory devices feed the data to a multiplexor that selects, as a function of the synchronizing clock, between the outputs of the two memory devices.

Abstract: Systems and methods for synchronizing a system clock signal with a reference clock signal having a reduced phased offset to improve operating speeds of integrated circuits. This is accomplished by generating delayed system and reference clock signals by using the system and reference clock signals. The generated delayed clock signals are then monitored to determine the arrival of the raising and falling edges of the delayed clock signals. The system clock signal is then compensated based on the determination of the arrival of the delayed clock signals to substantially synchronize the system clock signal with respect to the reference clock signal.

Abstract: A method includes specifying a first set of interconnected devices associated with a first leaf cell in Verilog syntax, and specifying a second set of interconnected devices associated with a second leaf cell in Verilog syntax. A connection between the first leaf cell and the second leaf cell is also specified in Verilog syntax. This specifies a circuit. The functionality of the logic can be tested by running a logic simulation on the circuit without converting to Verilog syntax. The Verilog syntax, associated with the circuit, can be converted directly from Verilog syntax to a SPICE netlist. The SPICE netlist can be used to simulate the timing and other parameters of the circuit. The Verilog syntax can be used to verify that the circuit as built. Also included are a computer readable medium including an instruction set for the above method, and a data structure necessary to carry out the above method.

Abstract: A vector-processor SIMD RISC computer system uses virtual addressing and overlapped instruction execution. Indicators for each of the architected registers assume different states when an instruction, overlapped with a vector memory-reference instruction, has or has not read from or written to a particular register. Multiple overlapped vector memory-reference instructions are assigned separate sets of indicators. Indicators in a certain state prevents a subsequent overlapped instruction from writing to its associated register.

Abstract: A multidimensional interconnection and routing apparatus for a parallel processing computer connects together possessing elements in a three-dimensional structure. The interconnection and routing apparatus includes a plurality of processing element nodes. A communication connects at least one of the processing elements with a host system. An interconnection network connects together the processing element nodes in an X, y, and Z dimension. The network includes communication paths connecting each of the plurality of processing elements to adjacent processing elements in the plus and minus directions of each of the X, Y, and Z dimensions.

Abstract: A multidimensional interconnection and routing apparatus for a parallel processing computer connects together processing elements in a three-dimensional structure. The interconnection and routing apparatus includes a plurality of processing element nodes. A communication connects at least one of the processing elements with a host system. An interconnection network connects together the processing element nodes in an X, Y, and Z dimension. The network includes communication paths connecting each of the plurality of processing elements to adjacent processing elements in the plus and minus directions of each of the X, Y, and Z dimensions.

Abstract: A multidimensional interconnection and routing apparatus for a parallel processing computer connects together processing elements in a three-dimensional structure. The interconnection and routing apparatus includes a plurality of processing element nodes. A communication connects at least one of the processing elements with a host system. An interconnection network connects together the processing element nodes in an X, Y, and Z dimension. The network includes communication paths connecting each of the plurality of processing elements to adjacent processing elements in the plus and minus directions of each of the X, Y, and Z dimensions.

Abstract: Logic unit cells are disclosed, consisting of an array of high speed logic gates, the outputs of which are wired together and coupled to a low power driver. High speed and switching rates are achieved by using very fast logic gates which have no gain and make use of a wired logic function in order to effect two levels of logic without adding the propagation delay through another logic gate. These arrays of logic gates are coupled to drivers which restore logic levels and provide the necessary power for driving interconnect capacitances while consuming and dissipating a minimum of power in the process. Another logic circuit discloses an array of logic gates as inputs to another logic gate, the individual gates consisting of gallium arsenide components and having drivers built into the output stage of each gate.

Abstract: An ECL circuit is capable of simultaneously responding to single-ended and differential inputs. The ECL circuit comprises a single-ended input, a differential input, logic responsive to the single-ended and differential inputs for determining a digital output state, and an output for communicating the output state to external devices. Each input, i.e., the single-ended input and the two complementary portions of the differential input, provide a base voltage for a control transistor. In order to allow the single-ended input to override the differential input, the differential input has half the voltage swing of the single-ended input and the high level of the differential input is halfway between the high and low levels of the single-ended input. In this way, an active single-ended input will exert more control over the current paths than the differential input. When the single-ended input is inactive, the differential input will exert control over the current paths.

Abstract: A READ-WHILE-WRITE current-mode logic RAM cell suitable for use in a RAM device having the ability to simultaneously write and read data.The RAM cell contains a bit-cell consisting of flip-flop configured transistors differentially connected to a constant current source, a multiple-emitter transistor network tied to each bit-cell load resistor which prevents the bit-cell from saturating, separate READ and WRITE data lines, and READ and WRITE buffer transistors having READ and WRITE control lines.

Abstract: Base-collector capacitance is reduced in a semiconductor device by making use of a buried oxide that is self-aligned to an active region of the semiconductor device. Use of the buried oxide provides a means for down-scaling or shrinking of the active device region which in turn increases the speed of the device. In addition, the area above the buried oxide is built up to reduce the resistance in the active region.

Abstract: A memory cell is provided having reduced read and write times, and a large current dynamic range between the standby mode and the read mode. A pair of cross-coupled NPN transistors operating in the inverse mode have their emitters coupled to a word line and their collectors coupled to receive a supply voltage by a first and second load, respectively. First and second NPN sense transistors each have a base coupled to the base of one of the cross-coupled transistors, an emitter coupled to a first and a second bit line, respectively, and a collector coupled to receive the supply voltage.

Abstract: A memory cell is provided having reduced read and write times, and a large current differential between the standby mode and the read mode. A pair of cross-coupled NPN transistors have their emitters coupled to a lower word line and their collectors coupled to an upper word line by a first and second load, respectively. First and second NPN sense transistors each have a base coupled to the base of one of the cross-coupled transistors, an emitter coupled to a first and a second bit line, respectively, and a collector coupled to receive a supply voltage.

Abstract: Improved bipolar transistors having minimum base-collector and collector-substrate junction area are formed by using multiple polycrystalline (e.g. doped poly silicon) layers to make lateral contact to a pillar shaped single crystal device region. The lateral poly silicon contacts are isolated from each other and the substrate and extend to the upper surface of the device for external connections. The structure is made by depositing two dielectric-poly layer sandwiches, etching and oxidizing part of the poly silicon layers to provide isolated overlapping poly silicon regions, etching a first hole through both poly silicon regions to the substrate, etching a second hole to the lower poly silicon layer, and filling the first and second holes with single and poly-crystalline silicon, respectfully. A sidewall oxide is formed at the periphery of the top of the single crystal pillar for defining the emitter location without additional masking.