Patents by Inventor Mark S. Granoff

Mark S. Granoff has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11043479
    Abstract: An opto-coupler includes a housing having end walls configured to have high-voltage (HV) input and output conductors protruding therethrough. The opto-coupler also includes at least one light emitting diode (LED) mounted to the housing and configured to activate the HV diode to pass electrical current by emitting light toward the HV diode. At least one press-fit end cap is configured to provide a press-fit seal either between the HV input conductor and the input end wall or between the HV output conductor and the output end wall. The press-fit end cap is configured to protect the LED from damage by shaping an electric field between the HV input or output conductor and the LED. Embodiments enable compact opto-coupler sizes with high-voltage ratings, such as 8 kV or 15 kV. Electrical current transfer ratios may be much higher than in existing opto-couplers.
    Type: Grant
    Filed: September 25, 2017
    Date of Patent: June 22, 2021
    Assignee: University of New Hampshire
    Inventors: Brian J. King, Mark S. Granoff, Philip DeMaine
  • Publication number: 20190221554
    Abstract: An opto-coupler includes a housing having end walls configured to have high-voltage (HV) input and output conductors protruding therethrough. The opto-coupler also includes at least one light emitting diode (LED) mounted to the housing and configured to activate the HV diode to pass electrical current by emitting light toward the HV diode. At least one press-fit end cap is configured to provide a press-fit seal either between the HV input conductor and the input end wall or between the HV output conductor and the output end wall. The press-fit end cap is configured to protect the LED from damage by shaping an electric field between the HV input or output conductor and the LED. Embodiments enable compact opto-coupler sizes with high-voltage ratings, such as 8 kV or 15 kV. Electrical current transfer ratios may be much higher than in existing opto-couplers.
    Type: Application
    Filed: September 25, 2017
    Publication date: July 18, 2019
    Inventors: Brian J. King, Mark S. Granoff, Philip DeMaine
  • Patent number: 6465729
    Abstract: A method for producing an electrical feedthru wherein a thin liquid conductive film is deposited into a shallow trough of an insulating machinable substrate. The conductive film and substrate are fired and then the resulting bound composite is ground flush with the adjacent surface of the insulating machinable substrate. The surface cohesion of the fired composite, and the resulting high quality surface finish of the grinding operation, combined with an elastomeric seal, create low leakage barriers capable of supporting a pressure differential while allowing isolated electrical conduction across a pressure or vacuum envelope. The method produces a space saving feedthru which allows a high signal line density in a limited space, is relatively simple to assemble, allows for disassembly rework, can be ‘designed into’ unique geometries of varied applications, and which has a single O-ring sealing across all traces.
    Type: Grant
    Filed: March 22, 2001
    Date of Patent: October 15, 2002
    Assignee: University of New Hampshire
    Inventors: Mark S. Granoff, Phillip D. Demaine, David Broderick, Stephen Ingemi
  • Publication number: 20010019755
    Abstract: A method for producing an electrical feedthru wherein a thin liquid conductive film is deposited into a shallow trough of an insulating machinable substrate. The conductive film and substrate are fired and then the resulting bound composite is ground flush with the adjacent surface of the insulating machinable substrate. The surface cohesion of the fired composite, and the resulting high quality surface finish of the grinding operation, combined with an elastomeric seal, create low leakage barriers capable of supporting a pressure differential while allowing isolated electrical conduction across a pressure or vacuum envelope. The method produces a space saving feedthru which allows a high signal line density in a limited space, is relatively simple to assemble, allows for disassembly rework, can be ‘designed into’ unique geometries of varied applications, and which has a single 0-ring sealing across all traces.
    Type: Application
    Filed: March 22, 2001
    Publication date: September 6, 2001
    Inventors: Mark S. Granoff, Phillip D. Demaine, David Broderick, Stephen Ingemi
  • Patent number: 6251471
    Abstract: A method for producing an electrical feedthru wherein a thin liquid conductive film is deposited into a shallow trough of an insulating machinable substrate. The conductive film and substrate are fired and then the resulting bound composite is ground flush with the adjacent surface of the insulating machinable substrate. The surface cohesion of the fired composite, and the resulting high quality surface finish of the grinding operation, combined with an elastomeric seal, create low leakage barriers capable of supporting a pressure differential while allowing isolated electrical conduction across a pressure or vacuum envelope. The method produces a space saving feedthru which allows a high signal line density in a limited space, is relatively simple to assemble, allows for disassembly rework, can be ‘designed into’ unique geometries of varied applications, and which has a single O-ring sealing across all traces.
    Type: Grant
    Filed: May 12, 1999
    Date of Patent: June 26, 2001
    Assignee: University of New Hampshire
    Inventors: Mark S. Granoff, Phillip D. Demaine, David Broderick, Stephen Ingemi