Abstract: A circuit board assembly includes a circuit board, a chip attached to the circuit board and a dielectric layer. The chip has a circuit facing the circuit board and spaced from it. The dielectric layer includes an aerogel. In one embodiment, the aerogel has a dielectric constant of approximately 2.0 or less and a compression strength of at least approximately 100 psi.

Abstract: A circuit board assembly includes a circuit board, a chip attached to the circuit board and a dielectric layer. The chip has a circuit facing the circuit board and spaced from it. The dielectric layer includes an aerogel. In one embodiment, the aerogel has a dielectric constant of approximately 2.0 or less and a compression strength of at least approximately 100 psi.

Abstract: A distributed control system for an active array antenna system is disclosed. In an exemplary embodiment, the array system employs many transmit/receive (T/R) modules each with an associated radiator element, a phase shifter element and a set of RF switch elements to set the module to transmit or receive modes. The array system is arranged to generate a transmit or receive array beam. The distributed control system in an exemplary embodiment includes an array processor for controlling the array, the processor configured to generate command signals to set the T/R module elements to transmit or receive mode and to steer the array beam to a desired direction. The command signals to steer the array beam include phase slopes common to all T/R modules in a given array or subarray.

Abstract: In one or more embodiments, a method of producing a stacked integrated circuit assembly includes providing a substrate having a top surface with at least one substrate connection pad. A first flip chip integrated circuit (FFIC) is disposed above the substrate, and a second flip chip integrated circuit (SFIC) is disposed above the FFIC. The FFIC may be disposed between the substrate and the SFIC. The method includes making at least one solder connection between the substrate connection pad and the FFIC and at least one solder connection between the FFIC and the SFIC.

Abstract: A distributed control system for an active array antenna system is disclosed. In an exemplary embodiment, the array system employs many transmit/receive (T/R) modules each with an associated radiator element, a phase shifter element and a set of RF switch elements to set the module to transmit or receive modes. The array system is arranged to generate a transmit or receive array beam. The distributed control system in an exemplary embodiment includes an array processor for controlling the array, the processor configured to generate command signals to set the T/R module elements to transmit or receive mode and to steer the array beam to a desired direction. The command signals to steer the array beam include phase slopes common to all T/R modules in a given array or subarray.

Abstract: A stacked integrated circuit assembly includes a substrate having a top surface with at least one substrate connection pad. A first flip chip integrated circuit (FFIC) is disposed above the substrate, and a second flip chip integrated circuit (SFIC) is disposed above the FFIC. The FFIC is disposed between the substrate and the SFIC. The stacked integrated circuit assembly includes least one solder connection between the substrate connection pad and the FFIC and at least one solder connection between the FFIC and the SFIC.

Abstract: An antenna array includes a folded thin flexible circuit board with a thin dielectric layer and a conductor layer pattern formed on a first surface of the dielectric layer. The circuit board may be folded in a plurality of folds to form a pleated structure. An array of radiator structures is formed on the first surface, A conductor trace pattern is formed on the folded circuit board. A plurality of active RF circuit devices is attached to the folded circuit board in signal communication with the conductor trace pattern.

Abstract: A stacked integrated circuit assembly includes a substrate having a top surface with at least one substrate connection pad. A first flip chip integrated circuit (FFIC) is disposed above the substrate, and a second flip chip integrated circuit (SFIC) is disposed above the FFIC. The FFIC is disposed between the substrate and the SFIC. The stacked integrated circuit assembly includes least one solder connection between the substrate connection pad and the FFIC and at least one solder connection between the FFIC and the SFIC.

Abstract: An antenna array includes a folded thin flexible circuit board with a thin dielectric layer and a conductor layer pattern formed on a first surface of the dielectric layer. The circuit board may be folded in a plurality of folds to form a pleated structure. An array of radiator structures is formed on the first surface, A conductor trace pattern is formed on the folded circuit board. A plurality of active RF circuit devices is attached to the folded circuit board in signal communication with the conductor trace pattern.

Abstract: An antenna array is assembled by direct attaching a flip chip transmit/receive (T/R) module to an antenna circuit board. A fillet bond is applied to the circuit board and the flip chip T/R module around at least a portion of the periphery of the flip chip T/R module.

Abstract: A foldable radiator assembly includes a flexible dielectric substrate structure having a radiator conductor pattern formed therein. The flexible substrate structure can be flexible for movement between a folded position and a deployed position, or can be fixed in position by dielectric structures. An excitation circuit excites the radiator conductor pattern with RF energy. Strips of the radiator assemblies can be used to form an array aperture.