Abstract: A laminate film comprising a polymer core layer; a resin layer disposed on a surface of the polymer layer; and a metal layer deposited on a surface of said resin layer; wherein the laminate film has excellent adhesion between the resin layer and the metal layer and barrier durability is disclosed.

Abstract: An integrated manufacturing system operative for managing the distribution to a factory floor as well as throughout a factory of the information that is necessary to effectuate the production of products on the factory floor. The information required for this purpose encompasses, but is not necessarily limited to, both the design information which is generated within the engineering enterprise and the scheduling information which is generated within the manufacturing resource planning system. This information consisting of design and manufacturing data pertaining to the product to be produced is in turn stored in a central repository for all shared information from whence as needed it is capable of being distributed in a logical and efficient fashion through operation of the integrated manufacturing system to the factory floor as well as throughout the factory so as to thereby enable the product to be produced on the factory floor in a most timely and most cost-effective manner.

Abstract: A printed circuit board is described in which an electrically insulating laminate material (40) has first and second sides. An electrically conducting first circuit pattern (15) is embedded in the first side of the laminate material (40), and an electrically conducting second circuit pattern (20) is embedded in the second side of the laminate material (40) electrically insulated from the first circuit pattern (15) by the laminate material (40). A solid interconnection member (20) extends through the laminate material (40) and electrically contacts both the first and second circuit patterns (15,20) at selected locations thereof.The method for fabricating the board includes as a first step the fabrication of a first board panel (10) having a raised electrically conducting first circuit pattern (15) extending from a base layer (14) of conductive material and a raised electrically conducting second circuit pattern (20) extending from the first circuit pattern (15).

Abstract: A printed circuit board is described in which an electrically insulating laminate material has first and second sides. An electrically conducting first circuit pattern is embedded in the first side of the laminate material, and an electrically conducting second circuit pattern is embedded in the second side of the laminate material electrically insulated from the first circuit pattern by the laminate material. A solid interconnection member extends through the laminate material and electrically contacts both the first and second circuit patterns at selected locations thereof.The method for fabricating the board includes as a first step the fabrication of a first board panel having a raised electrically conducting first circuit pattern extending from a base layer of conductive material.

Abstract: A printed circuit board is described in which an electrically insulating laminate material has first and second sides. An electrically conducting first circuit pattern is embedded in the first side of the laminate material, and an electrically conducting second circuit pattern is embedded in the second side of the laminate material electrically insulated from the first circuit pattern by the laminate material. A solid interconnection member extends through the laminate material and electrically contacts both the first and second circuit patterns at selected locations thereof.The method for fabricating the board includes as a first step the fabrication of a first board panel having a raised electrically conducting first circuit pattern extending from a base layer of conductive material.