Abstract: A semiconductor device has a substrate and plurality of first bumps formed over the substrate in an array. An array of second bumps is formed over the substrate on at least two sides of the first bumps. An electrical component is disposed over the first bumps. A package structure is disposed over the substrate and electrical component. The package structure has a horizontal member and legs extending from the horizontal member to form a cavity. The package structure is coupled to the array of second bumps. The package structure includes a material to operate as a heat sink or shielding layer. The shielding layer makes ground connection through the array of second bumps. The first bumps and second bumps have a similar height and width to form in the same manufacturing step. A protective layer, such as conductive epoxy, is disposed over the array of second bumps.

Abstract: A semiconductor device has a substrate and plurality of first bumps formed over the substrate in an array. An array of second bumps is formed over the substrate on at least two sides of the first bumps. An electrical component is disposed over the first bumps. A package structure is disposed over the substrate and electrical component. The package structure has a horizontal member and legs extending from the horizontal member to form a cavity. The package structure is coupled to the array of second bumps. The package structure includes a material to operate as a heat sink or shielding layer. The shielding layer makes ground connection through the array of second bumps. The first bumps and second bumps have a similar height and width to form in the same manufacturing step. A protective layer, such as conductive epoxy, is disposed over the array of second bumps.

Abstract: A semiconductor device has a substrate and plurality of first bumps formed over the substrate in an array. An array of second bumps is formed over the substrate on at least two sides of the first bumps. An electrical component is disposed over the first bumps. A package structure is disposed over the substrate and electrical component. The package structure has a horizontal member and legs extending from the horizontal member to form a cavity. The package structure is coupled to the array of second bumps. The package structure includes a material to operate as a heat sink or shielding layer. The shielding layer makes ground connection through the array of second bumps. The first bumps and second bumps have a similar height and width to form in the same manufacturing step. A protective layer, such as conductive epoxy, is disposed over the array of second bumps.

Abstract: An expandable-collapsible safe, comprising a first enclosure, a second enclosure, a door that is movable between an open position and a closed position, an adjustment mechanism adapted to move the first and second enclosures between a collapsed position and an expanded position, and a locking mechanism adapted to lock the door in the closed position.

Abstract: A method for restoring worn bores in a turret or other tool punch press is disclosed. The worn turret bore is refurbished by using a special boring bar and drive mechanism to enlarge the diameter of the worn section of the bore. A cylindrical sleeve is inserted into the re-bored bore and secured therein. The internal diameter of the sleeve has been machined to correspond to the unworn internal diameter of the bore. The outside diameter of the sleeve is sized to provide a slipfit with the enlarged diameter of the bore. Axial alignment of the worn turret bore is restored according to the invention by locating the boring bar along an axial centerline of an unworn region of the bore. The unworn region of the bore is the lower portion thereof and is the same diameter and in alignment with bore as originally machined. The boring bar utilizes the unworn portion of the bore as a reference when re-boring the worn portion of the bore.