Patents by Inventor Mark Samuel Phillips

Mark Samuel Phillips has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Dimpled heat shield
    Patent number: 10539375
    Abstract: A heat shield has a first layer, a second layer and a third layer. The first layer may have an outer surface and an inner surface. The second layer may have a first inner surface and a second inner surface. The third layer may have an inner surface and an outer surface, where the outer surface is defined by a plurality of dimples.
    Type: Grant
    Filed: January 30, 2018
    Date of Patent: January 21, 2020
    Assignee: Dana Automotive Systems Group, LLC
    Inventor: Mark Samuel Phillips
  • Dimple Heat Shield
    Publication number: 20190234694
    Abstract: A heat shield has a first layer, a second layer and a third layer. The first layer may have an outer surface and an inner surface. The second layer may have a first inner surface and a second inner surface. The third layer may have an inner surface and an outer surface, where the outer surface is defined by a plurality of dimples.
    Type: Application
    Filed: January 30, 2018
    Publication date: August 1, 2019
    Inventor: Mark Samuel Phillips