Patents by Inventor Mark Scalisi

Mark Scalisi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of electroplating copper into a via on a substrate from an acid copper electroplating bath
    Patent number: 10988852
    Abstract: Copper electroplating baths containing primary alcohol alkoxylate block copolymers and ethylene oxide/propylene oxide random copolymers having specific HLB ranges are suitable for filling vias with copper, where such copper deposits are substantially void-free and substantially free of surface defects.
    Type: Grant
    Filed: October 27, 2015
    Date of Patent: April 27, 2021
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Matthew Thorseth, Mark Scalisi, Corey Ciullo
  • Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of pyrazole compounds and bisepoxides
    Patent number: 10508349
    Abstract: Electroplating methods enable the plating of photoresist defined features which have substantially uniform morphology. The electroplating methods include copper electroplating baths with reaction products of pyrazole compounds and bisepoxides to electroplate the photoresist defined features. Such features include pillars, bond pads and line space features.
    Type: Grant
    Filed: June 13, 2017
    Date of Patent: December 17, 2019
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Ravi Pokhrel, Matthew Thorseth, James Byrnes, Mark Scalisi, Zuhra Niazimbetova, Joanna Dziewiszek
  • Copper electroplating baths and electroplating methods capable of electroplating megasized photoresist defined features
    Patent number: 10190228
    Abstract: Copper electroplating baths and methods enable the plating of photoresist defined megafeatures at high current densities which have substantially uniform morphology and reduced nodule development. The copper electroplating baths include a mixture of heterocyclic nitrogen containing copolymers which provide megafeatures having a good % TIR and % WID balance.
    Type: Grant
    Filed: March 7, 2017
    Date of Patent: January 29, 2019
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Matthew Thorseth, Rebecca Hazebrouck, Mark Scalisi, Zuhra Niazimbetova, Joanna Dziewiszek
  • METHOD OF ELECTROPLATING PHOTORESIST DEFINED FEATURES FROM COPPER ELECTROPLATING BATHS CONTAINING REACTION PRODUCTS OF PYRAZOLE COMPOUNDS AND BISEPOXIDES
    Publication number: 20170370014
    Abstract: Electroplating methods enable the plating of photoresist defined features which have substantially uniform morphology. The electroplating methods include copper electroplating baths with reaction products of pyrazole compounds and bisepoxides to electroplate the photoresist defined features. Such features include pillars, bond pads and line space features.
    Type: Application
    Filed: June 13, 2017
    Publication date: December 28, 2017
    Inventors: Ravi Pokhrel, Matthew Thorseth, James Byrnes, Mark Scalisi, Zuhra Niazimbetova, Joanna Dziewiszek
  • Plating method
    Patent number: 9809891
    Abstract: Copper electroplating baths having a surface tension of ?40 mN/m are suitable for filling vias with copper, where such copper deposits are substantially void-free and substantially free of surface defects.
    Type: Grant
    Filed: June 30, 2014
    Date of Patent: November 7, 2017
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Matthew A. Thorseth, Mark A. Scalisi, Luis A. Gomez, Bryan Lieb, Rebecca Lea Hazebrouck, Mark Lefebvre
  • COPPER ELECTROPLATING BATHS AND ELECTROPLATING METHODS CAPABLE OF ELECTROPLATING MEGASIZED PHOTORESIST DEFINED FEATURES
    Publication number: 20170283970
    Abstract: Copper electroplating baths and methods enable the plating of photoresist defined megafeatures at high current densities which have substantially uniform morphology and reduced nodule development. The copper electroplating baths include a mixture of heterocyclic nitrogen containing copolymers which provide megafeatures having a good % TIR and % WID balance.
    Type: Application
    Filed: March 7, 2017
    Publication date: October 5, 2017
    Inventors: Matthew Thorseth, Rebecca Hazebrouck, Mark Scalisi, Zuhra Niazimbetova, Joanna Dziewiszek
  • METHOD OF ELECTROPLATING COPPER INTO A VIA ON A SUBSTRATE FROM AN ACID COPPER ELECTROPLATING BATH
    Publication number: 20170114469
    Abstract: Copper electroplating baths containing primary alcohol alkoxylate block copolymers and ethylene oxide/propylene oxide random copolymers having specific HLB ranges are suitable for filling vias with copper, where such copper deposits are substantially void-free and substantially free of surface defects.
    Type: Application
    Filed: October 27, 2015
    Publication date: April 27, 2017
    Inventors: Matthew Thorseth, Mark Scalisi, Corey Ciullo
  • PLATING METHOD
    Publication number: 20150376807
    Abstract: Copper electroplating baths having a surface tension of ?40 mN/m are suitable for filling vias with copper, where such copper deposits are substantially void-free and substantially free of surface defects.
    Type: Application
    Filed: June 30, 2014
    Publication date: December 31, 2015
    Inventors: Matthew A. THORSETH, Mark A. SCALISI, Luis A. GOMEZ, Bryan LIEB, Rebecca Lea Hazebrouck, Mark LEFEBVRE