Abstract: The invention relates to a method for producing a mechanically autonomous microelectronic device comprising at least one electric via enabling an electric connection from at least one first face of the device, characterized in that it comprises the following sequence of operations: from a first substrate comprising a first portion of the electric via exposed to a first face of the first substrate, and from a second substrate comprising a second portion of the electric via exposed to a first face of the second substrate, a step of bonding of the first substrate onto the second substrate, by bonding the first faces thereof so that the first portion and the second portion of the electric via are in electrical continuity, step of partially removing a part of the first substrate from a second face of the first substrate, opposite the first face of said first substrate, so as to reach the first portion of the electric via.