Abstract: The invention describes a light emitting device (100). The light emitting device (100) comprises at least one light emitting structure (110), at least one processing layer (120) and at least one optical structure (130). The optical structure (130) comprises at least one material processed by means of processing light (150). The at least one processing layer (120) is arranged to reduce reflection of the processing light (150) in a direction of the optical structure (130) at least by 50%, preferably at least by 80%, more preferably at least by 95% and most preferably at least by 99% during processing of the material by means of the processing light (150). It is a basic idea of the present invention to incorporate a non- or low-reflective processing layer (120) on top of a light emitting structure (110) like a VCSEL array in order to enable on wafer processing of light emitting structures (130) like microlens arrays. The invention further describes a method of manufacturing such a light emitting device (100).

Abstract: The invention describes a light emitting device (100). The light emitting device (100) comprises at least one light emitting structure (110), at least one processing layer (120) and at least one optical structure (130). The optical structure (130) comprises at least one material processed by means of processing light (150). The at least one processing layer (120) is arranged to reduce reflection of the processing light (150) in a direction of the optical structure (130) at least by 50%, preferably at least by 80%, more preferably at least by 95% and most preferably at least by 99% during processing of the material by means of the processing light (150). It is a basic idea of the present invention to incorporate a non- or low-reflective processing layer (120) on top of a light emitting structure (110) like a VCSEL array in order to enable on wafer processing of light emitting structures (130) like microlens arrays. The invention further describes a method of manufacturing such a light emitting device (100).

Abstract: The present invention pertains to a process for the silicate bonding of joined surfaces, facing one another, of two components by means of an aqueous, alkaline, silicon-cation-containing joining solution for the purpose of producing an optical element, characterized in that one or both of said joined surfaces (1; 2b; 10) are covered with a layer of an oxide (3), which has a higher refractive index than SiO2 and is selected from among oxides of the third and fourth main group elements, of the second and third group of the transition elements as well as zirconium and from among mixed oxides of the said elements, whereupon the joining solution is applied to at least one of the surfaces to be joined and the surfaces are bonded to one another.

Abstract: The present invention pertains to a process for the silicate bonding of joined surfaces, facing one another, of two components by means of an aqueous, alkaline, silicon-cation-containing joining solution for the purpose of producing an optical element, characterized in that one or both of said joined surfaces (1; 2b; 10) are covered with a layer of an oxide (3), which has a higher refractive index than SiO2 and is selected from among oxides of the third and fourth main group elements, of the second and third group of the transition elements as well as zirconium and from among mixed oxides of the said elements, whereupon the joining solution is applied to at least one of the surfaces to be joined and the surfaces are bonded to one another.