Abstract: An apparatus includes a first device having a clock signal and configured to communicate, via a data bus, with a second device configured to assert a data strobe signal and a plurality of data bit signals on the data bus. The first device may include a control circuit configured, during a training phase, to determine relative timing between the clock signal, the plurality of data bit signals, and the data strobe signal. The first device may determine, using a first set of sampling operations, a first timing relationship of the plurality of data bit signals relative to the data strobe signal, and determine, using a second set of sampling operations, a second timing relationship of the plurality of data bit signals and the data strobe signal relative to the clock signal. During an operational phase, the control circuit may be configured to use delays based on the first and second timing relationships to sample data from the second device on the data bus.

Abstract: An apparatus includes a first device having a clock signal and configured to communicate, via a data bus, with a second device configured to assert a data strobe signal and a plurality of data bit signals on the data bus. The first device may include a control circuit configured, during a training phase, to determine relative timing between the clock signal, the plurality of data bit signals, and the data strobe signal. The first device may determine, using a first set of sampling operations, a first timing relationship of the plurality of data bit signals relative to the data strobe signal, and determine, using a second set of sampling operations, a second timing relationship of the plurality of data bit signals and the data strobe signal relative to the clock signal. During an operational phase, the control circuit may be configured to use delays based on the first and second timing relationships to sample data from the second device on the data bus.

Abstract: An apparatus includes a first device having a clock signal and configured to communicate, via a data bus, with a second device configured to assert a data strobe signal and a plurality of data bit signals on the data bus. The first device may include a control circuit configured, during a training phase, to determine relative timing between the clock signal, the plurality of data bit signals, and the data strobe signal. The first device may determine, using a first set of sampling operations, a first timing relationship of the plurality of data bit signals relative to the data strobe signal, and determine, using a second set of sampling operations, a second timing relationship of the plurality of data bit signals and the data strobe signal relative to the clock signal. During an operational phase, the control circuit may be configured to use delays based on the first and second timing relationships to sample data from the second device on the data bus.

Abstract: An apparatus includes a first device having a clock signal and configured to communicate, via a data bus, with a second device configured to assert a data strobe signal and a plurality of data bit signals on the data bus. The first device may include a control circuit configured, during a training phase, to determine relative timing between the clock signal, the plurality of data bit signals, and the data strobe signal. The first device may determine, using a first set of sampling operations, a first timing relationship of the plurality of data bit signals relative to the data strobe signal, and determine, using a second set of sampling operations, a second timing relationship of the plurality of data bit signals and the data strobe signal relative to the clock signal. During an operational phase, the control circuit may be configured to use delays based on the first and second timing relationships to sample data from the second device on the data bus.

Abstract: Embodiments include systems and methods for in-system, scan-based device testing using novel narrow-parallel (NarPar) implementations. Embodiments include a virtual automated test environment (VATE) system that can be disposed within the operating environment of an integrated circuit for which scan-based testing is desired (e.g., a chip under test, or CuT). For example, the VATE system is coupled with a service processor and with the CuT via a novel NarPar interface. A sequence controller can drive a narrow set of parallel scan pins on the CuT via the NarPar interface of the VATE system in accordance with an adapted test sequence having bit vector stimulants and expected responses. Responses of the CuT to the bit vector stimulants can be read out and compared to the expected results for scan-based testing of the chip.

Abstract: Embodiments include systems and methods for in-system, scan-based device testing using novel narrow-parallel (NarPar) implementations. Embodiments include a virtual automated test environment (VATE) system that can be disposed within the operating environment of an integrated circuit for which scan-based testing is desired (e.g., a chip under test, or CuT). For example, the VATE system is coupled with a service processor and with the CuT via a novel NarPar interface. A sequence controller can drive a narrow set of parallel scan pins on the CuT via the NarPar interface of the VATE system in accordance with an adapted test sequence having bit vector stimulants and expected responses. Responses of the CuT to the bit vector stimulants can be read out and compared to the expected results for scan-based testing of the chip.

Abstract: An embodiment is method comprising attaching a first die and a second die to a first surface of a first interposer using respective ones of first conductive connectors coupled to respective first surfaces of the first die and the second die; attaching a third die and a fourth die to a second surface of the first interposer using respective ones of second conductive connectors, the second surface of the first interposer being opposite the first surface of the interposer; and attaching the first die and the second die to a substrate using respective ones of third conductive connectors coupled to respective second surfaces of the first die and the second die.

Abstract: An embodiment is method comprising attaching a first die and a second die to a first surface of a first interposer using respective ones of first conductive connectors coupled to respective first surfaces of the first die and the second die; attaching a third die and a fourth die to a second surface of the first interposer using respective ones of second conductive connectors, the second surface of the first interposer being opposite the first surface of the interposer; and attaching the first die and the second die to a substrate using respective ones of third conductive connectors coupled to respective second surfaces of the first die and the second die.

Abstract: An embodiment is method comprising attaching a first die and a second die to a first surface of a first interposer using respective ones of first conductive connectors coupled to respective first surfaces of the first die and the second die; attaching a third die and a fourth die to a second surface of the first interposer using respective ones of second conductive connectors, the second surface of the first interposer being opposite the first surface of the interposer; and attaching the first die and the second die to a substrate using respective ones of third conductive connectors coupled to respective second surfaces of the first die and the second die.

Abstract: An embodiment is method comprising attaching a first die and a second die to a first surface of a first interposer using respective ones of first conductive connectors coupled to respective first surfaces of the first die and the second die; attaching a third die and a fourth die to a second surface of the first interposer using respective ones of second conductive connectors, the second surface of the first interposer being opposite the first surface of the interposer; and attaching the first die and the second die to a substrate using respective ones of third conductive connectors coupled to respective second surfaces of the first die and the second die.

Abstract: A structure comprises a first die, a second die, an interposer, a third die, and a fourth die. The first die and the second die each have a first surface and a second surface. First conductive connectors are coupled to the first surfaces of the first and second dies, and second conductive connectors are coupled to the second surfaces of the first and second dies. The interposer is over the first and second dies. A first surface of the interposer is coupled to the first conductive connectors, and a second surface of the interposer is coupled to third conductive connectors. The third and fourth dies are over the interposer and are coupled to the third conductive connectors. The first die is communicatively coupled to the second die through the interposer, and/or the third die is communicatively coupled to the fourth die through the interposer.

Abstract: A structure comprises a first die, a second die, an interposer, a third die, and a fourth die. The first die and the second die each have a first surface and a second surface. First conductive connectors are coupled to the first surfaces of the first and second dies, and second conductive connectors are coupled to the second surfaces of the first and second dies. The interposer is over the first and second dies. A first surface of the interposer is coupled to the first conductive connectors, and a second surface of the interposer is coupled to third conductive connectors. The third and fourth dies are over the interposer and are coupled to the third conductive connectors. The first die is communicatively coupled to the second die through the interposer, and/or the third die is communicatively coupled to the fourth die through the interposer.

Abstract: A non-blocking load buffer is provided for use in a high-speed microprocessor and memory system. The non-blocking load buffer interfaces a high-speed processor/cache bus, which connects a processor and a cache to the non-blocking load buffer, with a lower speed peripheral bus, which connects to peripheral devices. The non-blocking load buffer allows data to be retrieved from relatively low bandwidth peripheral devices directly from programmed I/O of the processor at the maximum rate of the peripherals so that the data may be processed and stored without unnecessarily idling the processor. I/O requests from several processors within a multiprocessor may simultaneously be buffered so that a plurality of non-blocking loads may be processed during the latency period of the device. As a result, a continuous maximum throughput from multiple I/O devices by the programmed I/O of the processor is achieved and the time required for completing tasks and processing data may be reduced.

Abstract: A non-blocking load buffer for use in a high-speed microprocessor and memory system. The non-blocking load buffer interfaces a high-speed processor/cache bus, which connects a processor and a cache to the non-blocking load buffer, with a lower speed peripheral bus, which connects to peripheral devices. The non-blocking load buffer allows data to be retrieved from relatively low bandwidth peripheral devices directly from programmed I/O of the processor at the maximum rate of the peripherals so that the data may be processed and stored without unnecessarily idling the processor. I/O requests from several processors within a multiprocessor may simultaneously be buffered so that a plurality of non-blocking loads may be processed during the latency period of the device. As a result, a continuous maximum throughput from multiple I/O devices by the programmed I/O of the processor is achieved and the time required for completing tasks and processing data may be reduced.

Abstract: A non-blocking load buffer is provided for use in a high-speed microprocessor and memory system. The non-blocking load buffer interfaces a high-speed processor/cache bus, which connects a processor and a cache to the non-blocking load buffer, with a lower speed peripheral bus, which connects to peripheral devices. The non-blocking load buffer allows data to be retrieved from relatively low bandwidth peripheral devices directly from programmed I/O of the processor at the maximum rate of the peripherals so that the data may be processed and stored without unnecessarily idling the processor. I/O requests from several processors within a multiprocessor may simultaneously be buffered so that a plurality of non-blocking loads may be processed during the latency period of the device. As a result, a continuous maximum throughput from multiple I/O devices by the programmed I/O of the processor is achieved and the time required for completing tasks and processing data may be reduced.

Abstract: The present invention provides a means for operating the CPU in a single chip microprocessor at a multipe of the cycle speed of the memory bus. With the present invention, first and second timing signals are provided. The frequency of the second timing signal is a multiple of the frequency of the first timing signal. The second or fast timing signal is provided to the CPU and the first or slower timing signal is provided to the memory subsystem. A bus interface unit is interposed between the CPU and the memory bus. This bus interface unit receives the RDY signal (i.e. the ready signal) from the memory subsystem and modifies it before it is provided to the CPU. The "ready" signal from the memory subsystem is in an undefined state for a significant portion of each bus cycle. Since at least two CPU cycles occur during each memory access, the bus interface unit must ensure that the CPU does not misinterpret the ready signal from the memory subsystem. The bus interface unit also must modify the ADS signal (i.e.

Abstract: The present invention provides a means for operating the CPU in a single chip microprocessor at a multipe of the cycle speed of the memory bus. With the present invention, first and second timing signals are provided. The frequency of the second timing signal is a multiple of the frequency of the first timing signal. The second or fast timing signal is provided to the CPU and the first or slower timing signal is provided to the memory subsystem. A bus interface unit is interposed between the CPU and the memory bus. This bus interface unit receives the RDY signal (i.e. the ready signal) from the memory subsystem and modifies it before it is provided to the CPU. The "ready" signal from the memory subsystem is in an undefined state for a significant portion of each bus cycle. Since at least two CPU cycles occur during each memory access, the bus interface unit must ensure that the CPU does not misinterpret the ready signal from the memory subsystem. The bus interface unit also must modify the ADS signal (i.e.

Abstract: A computer system architecture implementing multiple central processing units, each including a split instruction and operand cache, and that provides for the management of multiple copies (line pairs) of a memory line through the use of a line pair state is described. Systematic management of memory lines when transferred with respect to instruction and operand data cache memories allows the integrity of the system to be maintained at all times. The split cache architecture management determines whether a memory line having a first predetermined system address is present within both the instruction and operand cache memories or will be upon move-in of a memory line. Address tag line pair state information is maintained to allow determinations of whether and where the respective memory line pair members reside. The architecture implements the management of the line pairs on each transfer of a memory line to any of the split caches of the system.