Patents by Inventor Mark Sheward

Mark Sheward has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Catheter tip device and method for manufacturing same
    Patent number: 8140146
    Abstract: A catheter tip device and methods for manufacturing a catheter tip device are disclosed, the device comprising a transducer module attached to a capsule, wherein the transducer module comprises a carrier including a recessed die-attach area, a transducer die located in the recessed die-attach area, and at least one conductive lead deposited onto the carrier and interconnected to the transducer die. The recessed die-attach area has an outer perimeter greater than the outer perimeter of the transducer die forming a groove between at least one edge of the transducer die and the outer perimeter in which an adhesive agent is located to attach the transducer die to the recessed die-attach area. The methods of manufacturing the catheter tip device involve the use of an array of carriers.
    Type: Grant
    Filed: May 30, 2008
    Date of Patent: March 20, 2012
    Assignee: General Electric Company
    Inventors: Woojin Kim, Michael Klitzke, Mark Sheward, Brad Jeffrey Neiman
  • CATHETER TIP DEVICE AND METHOD FOR MANUFACTURING SAME
    Publication number: 20090299178
    Abstract: A catheter tip device and methods for manufacturing a catheter tip device are disclosed, the device comprising a transducer module attached to a capsule, wherein the transducer module comprises a carrier including a recessed die-attach area, a transducer die located in the recessed die-attach area, and at least one conductive lead deposited onto the carrier and interconnected to the transducer die. The recessed die-attach area has an outer perimeter greater than the outer perimeter of the transducer die forming a groove between at least one edge of the transducer die and the outer perimeter in which an adhesive agent is located to attach the transducer die to the recessed die-attach area. The methods of manufacturing the catheter tip device involve the use of an array of carriers.
    Type: Application
    Filed: May 30, 2008
    Publication date: December 3, 2009
    Inventors: Woojin Kim, Michael Klitzke, Mark Sheward, Brad Jeffrey Neiman