Abstract: Automatic gain control (AGC) may be accomplished in a radio frequency (RF) amplifier in a hybrid fiber-coaxial (HFC) network using a wideband RF tuner to select multiple pilot channels (e.g., frequencies in lower and upper portions of an RF signals spectrum) for use in measuring power and determining a correction to be applied to the RF amplifier. The power of the pilot channel or channels may be measured, for example, using a received signal strength indicator (RSSI) from the wideband RF tuner or using a power detector circuit. Using the wideband RF tuner allows selectable gain and/or tilt control across a wideband spectrum, such as a channel spectrum of a CATV downstream RF signal, to maintain stable RF output levels of the amplifier as RF input levels vary. The RF amplifier may be a line extender amplifier used in a CATV HFC network to amplify a wideband RF spectrum of up to 1.8 GHz.

Abstract: A broadband digital access (BDA) architecture includes a BDA hub device in a headend/hub and one or more BDA node modules in one or more HFC nodes to enable digital communications between the headend/hub and the HFC node(s) in a CATV/HFC network. The BDA hub device and the BDA node module(s) are connected by one or more downstream optical fibers and one or more upstream optical fibers to enable digital optical communications therebetween. The BDA hub device provides an analog RF interface with equipment in the headend/hub and the BDA node module provides an analog RF interface with subscriber locations via one or more coaxial cables.

Abstract: A heat transfer assembly may be used to provide a thermal conduit from a module mounted on a circuit board through the circuit board, allowing a thermal path away from the module. The heat transfer assembly generally includes a thermally conductive base with at least one raised thermal pedestal accessible through at least one heat transfer aperture in the circuit board and in thermal contact with the module. In an embodiment, the heat transfer assembly is used in a remote PHY device (RPD) in an optical node, for example, in a CATV/HFC network. The RPD includes an enclosure having a base with at least one raised thermal pedestal in thermal contact with an optical module (e.g., an optical transmitter or transceiver) on a circuit board through at least one heat transfer aperture in the circuit board.

Abstract: A heat transfer assembly may be used to provide a thermal conduit from a module mounted on a circuit board through the circuit board, allowing a thermal path away from the module. The heat transfer assembly generally includes a thermally conductive base with at least one raised thermal pedestal accessible through at least one heat transfer aperture in the circuit board and in thermal contact with the module. In an embodiment, the heat transfer assembly is used in a remote PHY device (RPD) in an optical node, for example, in a CATV/HFC network. The RPD includes an enclosure having a base with at least one raised thermal pedestal in thermal contact with an optical module (e.g., an optical transmitter or transceiver) on a circuit board through at least one heat transfer aperture in the circuit board.