Abstract: The present invention relates to a method for manufacturing a functional structure having the steps of: providing a base body of the functional structure; applying at least one metallic layer to a surface of the base body, wherein the surface of the base body has one or more anchoring elements at least in certain areas, which are designed and arranged to improve the adhesion of the metallic layer to the surface compared to an adhesion of the metallic layer to a surface without anchoring elements.

Abstract: The present invention relates to a method for smoothing the inner side of a high-frequency waveguide, wherein the waveguide has a main body with an outer side and with an inner side and wherein the main body contains one or more clearances, which extend between the outer side and the inner side, wherein the smoothing of the inner side of the waveguide is performed by means of a galvanic process in which a layer generated by the galvanic process is formed on the inner side of the waveguide and has the effect of smoothing the inner side of the waveguide.

Abstract: The present invention relates to a method for producing high-frequency functional structures comprising the following steps: —producing a replica of the functional structure; —forming the replica into a molding material; —removing the replica from the molding material, with the result that a casting mold is produced; —pouring melt into the casting mold; —demolding of the solidified melt, wherein over 90%, preferably over 95%, in particular over 99% of the mass of the image consists of a pure material.

Abstract: The present invention relates to an antenna structure comprising a waveguide, with the waveguide comprising a guide element for guiding waves and with a termination structure protruding away from the guide element being provided adjacent to the latter.

Abstract: The present disclosure relates to a modular antenna array, in particular a modular MIMO antenna array, for evaluating different antenna array characteristics, and comprises a printed circuit board with a chipset for transmitting and/or receiving a high-frequency electromagnetic wave, and at least one unbundling component for mounting on the printed circuit board to guide the electromagnetic wave emitted from the printed circuit board to a transfer point of the unbundling component and/or to guide the electromagnetic wave received at a transfer point of the unbundling component to the printed circuit board.

Abstract: The present invention relates to a method for manufacturing an electronic or electrical system, the method comprising the layer-free production of at least one physical structure (101, 102) which is designed to guide electromagnetic waves, using at least one additively operating apparatus, wherein the layer-free production of the spatial, layer-free structure comprises the simultaneous or sequential application and/or removal of one or more materials in the spatial arrangement, as a result of which the electronic or electrical system is partially or completely formed. The invention further relates to a system which is manufactured in accordance with the method.

Abstract: The invention relates to a method of manufacturing technical radio frequency functional structures comprising the steps of providing a base body determining the shape of the functional structure and applying an electrically conductive layer to the shape-determining base body by means of wetting the base body with a dispersion containing microparticles and/or nanoparticles.

Abstract: The present invention relates to a method for manufacturing an electronic or electrical system, the method comprising the layer-free production of at least one physical structure (101, 102) which is designed to guide electromagnetic waves, using at least one additively operating apparatus, wherein the layer-free production of the spatial, layer-free structure comprises the simultaneous or sequential application and/or removal of one or more materials in the spatial arrangement, as a result of which the electronic or electrical system is partially or completely formed. The invention further relates to a system which is manufactured in accordance with the method.