Abstract: The present disclosure relates to a modular antenna array, in particular a modular MIMO antenna array, for evaluating different antenna array characteristics, and comprises a printed circuit board with a chipset for transmitting and/or receiving a high-frequency electromagnetic wave, and at least one unbundling component for mounting on the printed circuit board to guide the electromagnetic wave emitted from the printed circuit board to a transfer point of the unbundling component and/or to guide the electromagnetic wave received at a transfer point of the unbundling component to the printed circuit board.

Abstract: The present invention relates to a method for manufacturing an electronic or electrical system, the method comprising the layer-free production of at least one physical structure (101, 102) which is designed to guide electromagnetic waves, using at least one additively operating apparatus, wherein the layer-free production of the spatial, layer-free structure comprises the simultaneous or sequential application and/or removal of one or more materials in the spatial arrangement, as a result of which the electronic or electrical system is partially or completely formed. The invention further relates to a system which is manufactured in accordance with the method.

Abstract: The invention relates to a method of manufacturing technical radio frequency functional structures comprising the steps of providing a base body determining the shape of the functional structure and applying an electrically conductive layer to the shape-determining base body by means of wetting the base body with a dispersion containing microparticles and/or nanoparticles.

Abstract: The present invention relates to a method for manufacturing an electronic or electrical system, the method comprising the layer-free production of at least one physical structure (101, 102) which is designed to guide electromagnetic waves, using at least one additively operating apparatus, wherein the layer-free production of the spatial, layer-free structure comprises the simultaneous or sequential application and/or removal of one or more materials in the spatial arrangement, as a result of which the electronic or electrical system is partially or completely formed. The invention further relates to a system which is manufactured in accordance with the method.