Patents by Inventor Mark Spencer Grey

Mark Spencer Grey has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SPATULA FOR SEPARATION OF THINNED WAFER FROM MOUNTING CARRIER
    Publication number: 20020088556
    Abstract: A wafer removing spatula has a handle connected to a tray. A shaft of the handle is provided with a pair of support guides and the tray is provided with a wafer support surface which rests on a tray support surface. The support guides and the tray support surface are configured and dimensioned to ensure that the wafer support surface is substantially parallel to the upper surface of a base plate on which both the support guides and the tray support surface rest. A front edge of the wafer support surface is provided with a bevel to facilitate lifting a wafer from a wafer carrier surface. The height of the lowermost portion of the front edge is approximately the same as the height of a wafer carrier placed on the base plate. During operation, the spatula is moved on the base plate towards the carrier with the wafer mounted thereon.
    Type: Application
    Filed: January 10, 2001
    Publication date: July 11, 2002
    Inventors: Bhola De, Mark Spencer Grey
  • Spatula for separation of thinned wafer from mounting carrier
    Patent number: 6415843
    Abstract: A wafer removing spatula has a handle connected to a tray. A shaft of the handle is provided with a pair of support guides and the tray is provided with a wafer support surface which rests on a tray support surface. The support guides and the tray support surface are configured and dimensioned to ensure that the wafer support surface is substantially parallel to the upper surface of a base plate on which both the support guides and the tray support surface rest. A front edge of the wafer support surface is provided with a bevel to facilitate lifting a wafer from a wafer carrier surface. The height of the lowermost portion of the front edge is approximately the same as the height of a wafer carrier placed on the base plate. During operation, the spatula is moved on the base plate towards the carrier with the wafer mounted thereon.
    Type: Grant
    Filed: January 10, 2001
    Date of Patent: July 9, 2002
    Assignee: Anadigics, Inc.
    Inventors: Bhola De, Mark Spencer Grey