Patents by Inventor Mark Steidlitz

Mark Steidlitz has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • High heat dissipation mounting for solid state devices and circuits
    Patent number: 4069497
    Abstract: A solid state device or circuit mounted or printed on a heat conductive ceramic substrate such as beryllia is brought into thermal conductive relation with a metal heat dissipation plate as by clamping with no intervening materials such as an adhesive or solder therebetween.
    Type: Grant
    Filed: August 13, 1975
    Date of Patent: January 17, 1978
    Assignee: EMC Technology, Inc.
    Inventor: Mark Steidlitz