Abstract: A heat exchanger for a chip package is provided. The heat exchanger includes a body having an upper side, a lower side, and an internal cavity disposed in the body between the upper side and the lower side. A first outlet port and a second outlet port are formed in the body and are in fluid communication with the internal cavity. An inlet port is formed through the upper side of the body between the first and second outlet ports to supply fluid into the internal cavity.

Abstract: The described apparatus can include a printed circuit board having a first side that includes an integrated circuit and a second side that is opposite the first side and that includes one or more power delivery components. The apparatus can additionally include a cooling system positioned to cool the one or more power delivery components located on the second side of the printed circuit board. Various other methods and systems are also disclosed.

Abstract: Disclosed herein are electronic devices that utilized a thermal bus disposed on a backside of a printed circuit board (PCB) to route heat efficiently to a thermal management device disposed on the front side of the PCB, thus enhancing thermal regulation of integrated circuit (IC) devices mounted on the backside of the PCB.

Abstract: A chip package, an electronic device, and methods for fabricating the same are disclosed herein. In one example, a chip package includes a package substrate, an integrated circuit (IC) die, and a stiffener. The IC die has a first height and is mounted on a top surface of the package substrate. The stiffener is mounted to the top surface of the package substrate. A cavity is disposed in the stiffener. The cavity has an opening formed through the stiffener that faces towards the IC die.

Abstract: A method for cooling accelerators having back side power delivery components can include providing a printed circuit board having a first side that includes an integrated circuit and a first set of one or more power delivery components and a second side that is opposite the first side and that includes a second set of one or more power delivery components. The method can also include positioning a first cooling system to cool the integrated circuit and the first set of one or more power delivery components. The method can further include positioning a second cooling system to cool the second set of one or more power delivery components. Various other methods and systems are also disclosed.

Abstract: A method for server level cooling can include providing a printed circuit board and attaching a cooling system to the printed circuit board. The cooling system can be configured for placement thereon of two or more expansion cards having back side power delivery components. Various other methods, systems, and computer-readable media are also disclosed.

Abstract: Disclosed herein are electronic devices that utilized a thermal bus disposed on a backside of a printed circuit board (PCB) to route heat efficiently to a thermal management device disposed on the front side of the PCB, thus enhancing thermal regulation of integrated circuit (IC) devices mounted on the backside of the PCB.

Abstract: A heat exchanger for a chip package is provided. The heat exchanger includes a body having an upper side, a lower side, and an internal cavity disposed in the body between the upper side and the lower side. A first outlet port and a second outlet port are formed in the body and are in fluid communication with the internal cavity. An inlet port is formed through the upper side of the body between the first and second outlet ports to supply fluid into the internal cavity.