Patents by Inventor Mark Stephen Topping

Mark Stephen Topping has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Integrated lighting assembly
    Patent number: 6076950
    Abstract: An integrated lighting assembly (10) includes an injection molded housing that has a base (12) with first fastening elements (22) molded thereon, a cover (18) with second fastening elements (24) molded thereon, and a substrate (16) intermediate the base and cover. An electrical circuit (30) is formed on the substrate and a lighting element (32) is attached to the electrical circuit. A reflective cone (34, 36) surrounds the lighting element to intensify its light and direct light through a diffuser lens (28) formed on the base. A reflective wall (26) on the base reflects light emanating from the diffuser lens in a predetermined pattern. Metal for the reflective surface and electrical circuit is deposited in a single operation. The base and cover are connected to the substrate by living hinges. When the cover is folded onto the base, the first and second fastening elements snap together to form a three dimensional lighting assembly.
    Type: Grant
    Filed: October 5, 1998
    Date of Patent: June 20, 2000
    Assignee: Ford Global Technologies, Inc.
    Inventors: Mark Stephen Topping, Michael G. Todd, Mark Miller
  • Method for ultrasonic bonding flexible circuits
    Patent number: 6019271
    Abstract: A method for bonding together at least two conductive members 20, wherein each member includes at least one metallic 22 having a respective bonding area 24. At least one member has a deposition of metallic bonding material 26 attached to each respective conductor proximate each bonding area, and at least one member has a plastic element 28 attached thereto proximate each respective bonding area. The members 20 are positioned in a predetermined orientation, clamped together between an ultrasonic horn and anvil arrangement, with pressure and orthogonal ultrasonic energy being applied thereto so that each plastic element 28 is heated, which in turn melts the bonding material 26. Any plastic element material between the conductors is squeezed away therefrom and the respective conductors 22 are brought into proximity with each other so that a molten joint of bonding material physically contacts each respective conductor.
    Type: Grant
    Filed: July 11, 1997
    Date of Patent: February 1, 2000
    Assignee: Ford Motor Company
    Inventors: Brian John Hayden, Cuong Van Pham, Rosa Lynda Nuno, Mark Stephen Topping
  • Method of soldering materials supported on low-melting substrates
    Patent number: 5921460
    Abstract: A method of soldering materials by controlling ultrasonic energy to effect melting of only the solder in an assembly to be joined that is carried on a low temperature melting substrate.
    Type: Grant
    Filed: June 5, 1997
    Date of Patent: July 13, 1999
    Assignee: Ford Motor Company
    Inventors: Mark Stephen Topping, Cuong Van Pham, Brian John Hayden