Abstract: An integrated circuit is adapted for implementing flip-chip technology with solder bumps, while providing for improved testability. The integrated circuit comprises two sets of pads formed in the same metal layer, with a first set being used for wafer probing, and a second set for solder bumps. The wafer probe pads are placed in one row along each chip edge. A second set of pads, the solder bump pads, are arranged in rows towards the center of the chip with respect to the wafer probe pads. Metal interconnects formed in the same metal layer as the pads connects each solder bump pad to a corresponding wafer probe pad. Testing of the integrated circuit may be accomplished using the wafer probe pads according to conventional techniques, while mounting of the chip may be accomplished with the solder bump pads using the flip-chip technology.