Abstract: A fluid flow control device includes a body having an inlet connection, an outlet connection, and a discharge port. A supply path extends between the inlet connection and the outlet connection and a booster module is disposed within the body. The booster module includes a control element and an actuator element and defines an exhaust path extending between the outlet connection and the discharge port. A supply port is disposed within the booster module along the supply path between the inlet connection and the outlet connection and at least a first damping means operatively connected to the booster module.

Abstract: A fluid flow control device includes a body having an inlet connection, an outlet connection, and a discharge port. A supply path extends between the inlet connection and the outlet connection and a booster module is disposed within the body. The booster module includes a control element and an actuator element and defines an exhaust path extending between the outlet connection and the discharge port. A supply port is disposed within the booster module along the supply path between the inlet connection and the outlet connection and at least a first damping means operatively connected to the booster module.

Abstract: In an exemplary embodiment of the present invention, an optical interface unit provides an interface between an optoelectronic device and industry standard MTP/MPO connectors. The optical interface unit axially aligns the core of a fiber with the optoelectronic device and interfaces that fiber to the standardized connector. In addition, the optical interface unit further provides a standardized interface for visible contact connection between the individual fiber stubs and the terminated fibers in the standardized connector. The optical interface unit therefore maximizes coupling from the optoelectronic device with the standardized connector.

Abstract: In an exemplary embodiment of the present invention, an optical interface unit provides an interface between an optoelectronic device and industry standard MTP/MPO connectors. The optical interface unit axially aligns the core of a fiber with the optoelectronic device and interfaces that fiber to the standardized connector. In addition, the optical interface unit further provides a standardized interface for visible contact connection between the individual fiber stubs and the terminated fibers in the standardized connector. The optical interface unit therefore maximizes coupling from the optoelectronic device with the standardized connector.

Abstract: In an exemplary embodiment of the present invention, an optical interface unit provides an interface between an optoelectronic device and industry standard MTP/MPO connectors. The optical interface unit axially aligns the core of a fiber with the optoelectronic device and interfaces that fiber to the standardized connector. In addition, the optical interface unit further provides a standardized interface for visible contact connection between the individual fiber stubs and the terminated fibers in the standardized connector. The optical interface unit therefore maximizes coupling from the optoelectronic device with the standardized connector.

Abstract: A multilayer ceramic carrier for an optical element includes a terraced cavity for retaining a vertically receiving or vertically emitting optical element. The multilayer ceramic carrier includes conductive traces interposed between the ceramic layers and which extend into the terraced cavity along the trenches formed in the cavity. A vertical cavity surface emitting laser or vertically receiving optical element is wire bonded to the conductive traces which extend into the cavity. In one embodiment, the terraced cavity of the multilayer ceramic carrier includes a VCSEL and photodetector therein, the photodetector capable of monitoring the output optical power of the VCSEL. The method for forming the multilayer ceramic carrier includes forming a plurality of layers of ceramic tape, joining the layers, then co-firing the stacked layers. The multilayer ceramic carrier is joined to a plastic optical housing which includes an aperture for securing an optical fiber.

Abstract: A multilayer ceramic carrier for an optical element includes a terraced cavity for retaining a vertically receiving or vertically emitting optical element. The multilayer ceramic carrier includes conductive traces interposed between the ceramic layers and which extend into the terraced cavity along the trenches formed in the cavity. A vertical cavity surface emitting laser or vertically receiving optical element is wire bonded to the conductive traces which extend into the cavity. In one embodiment, the terraced cavity of the multilayer ceramic carrier includes a VCSEL and photodetector therein, the photodetector capable of monitoring the output optical power of the VCSEL. The method for forming the multilayer ceramic carrier includes forming a plurality of layers of ceramic tape, joining the layers, then co-firing the stacked layers. The multilayer ceramic carrier is joined to a plastic optical housing which includes an aperture for securing an optical fiber.

Abstract: A multilayer ceramic carrier for an optical element includes a terraced cavity for retaining a vertically receiving or vertically emitting optical element. The multilayer ceramic carrier includes conductive traces interposed between the ceramic layers and which extend into the terraced cavity along the trenches formed in the cavity. A vertical cavity surface emitting laser or vertically receiving optical element is wire bonded to the conductive traces which extend into the cavity. In one embodiment, the terraced cavity of the multilayer ceramic carrier includes a VCSEL and photodetector therein, the photodetector capable of monitoring the output optical power of the VCSEL. The method for forming the multilayer ceramic carrier includes forming a plurality of layers of ceramic tape, joining the layers, then co-firing the stacked layers. The multilayer ceramic carrier is joined to a plastic optical housing which includes an aperture for securing an optical fiber.

Abstract: A multilayer ceramic carrier for an optical element includes a terraced cavity for retaining a vertically receiving or vertically emitting optical element. The multilayer ceramic carrier includes conductive traces interposed between the ceramic layers and which extend into the terraced cavity along the trenches formed in the cavity. A vertical cavity surface emitting laser or vertically receiving optical element is wire bonded to the conductive traces which extend into the cavity. In one embodiment, the terraced cavity of the multilayer ceramic carrier includes a VCSEL and photodetector therein, the photodetector capable of monitoring the output optical power of the VCSEL. The method for forming the multilayer ceramic carrier includes forming a plurality of layers of ceramic tape, joining the layers, then co-firing the stacked layers. The multilayer ceramic carrier is joined to a plastic optical housing which includes an aperture for securing an optical fiber.

Abstract: A sealing feature for a multiple-piece housing for optoelectronic devices. The housing provides EMI shielding and axial stain suppression for optical fibers coupled to optoelectronic devices retained within the housing. In an exemplary embodiment, the scaling feature includes a corrugated channel having a cross-sectional area that varies along the longitudinal direction of said channel and the channel retains a gasket having a substantially constant cross-sectional area. The corrugated channel, which receives the gasket, includes varying wide and narrow sections. The sealing feature provides for sufficient compression throughout the gasket and a tight, EMI-shielding seal formed between the pieces of the housing.

Abstract: In an exemplary embodiment of the present invention, an optical interface unit provides an interface between an optoelectronic device and industry standard MTP/MPO connectors. The optical interface unit axially aligns the core of a fiber with the optoelectronic device and interfaces that fiber to the standardized connector. In addition, the optical interface unit further provides a standardized interface for visible contact connection between the individual fiber stubs and the terminated fibers in the standardized connector. The optical interface unit therefore maximizes coupling from the optoelectronic device with the standardized connector.

Abstract: A housing for optoelectronic devices provides EMI shielding and axial strain suppression for optical fibers coupled to optoelectronic devices retained within the housing. The housing includes an internal septum for EMI shielding and a grounding scheme including relief features of the conductive housing coupled to internal grounding strips. The housing provides a first exemplary engaging/locking feature including an orthogonal tongue and a groove that receives the tongue, and a second exemplary engaging/locking feature that includes a groove having an intermittently varying cross-sectional area and that retains a gasket of constant cross-sectional area. Arms extend from the housing and retain an optical fiber that is secured to the arm by an adhesive such that axial strain is not exerted at the point of optical coupling and a high optical coupling efficiency is maintained.

Abstract: In an exemplary embodiment of the present invention, an optical interface unit provides an interface between an optoelectronic device and industry standard MTP/MPO connectors. The optical interface unit axially aligns the core of a fiber with the optoelectronic device and interfaces that fiber to the standardized connector. In addition, the optical interface unit further provides a standardized interface for visible contact connection between the individual fiber stubs and the terminated fibers in the standardized connector. The optical interface unit therefore maximizes coupling from the optoelectronic device with the standardized connector.

Abstract: A housing for optoelectronic devices provides EMI shielding and axial strain suppression for optical fibers coupled to optoelectronic devices retained within the housing. The housing includes an internal septum for EMI shielding and a grounding scheme including relief features of the conductive housing coupled to internal grounding strips. The housing provides a first exemplary engaging/locking feature including an orthogonal tongue and a groove that receives the tongue, and a second exemplary engaging/locking feature that includes a groove having an intermittently varying cross-sectional area and that retains a gasket of constant cross-sectional area. Arms extend from tho housing and retain an optical fiber that is secured to the arm by an adhesive such that axial strain is not exerted at the point of optical coupling and a high optical coupling efficiency is maintained.

Abstract: A method and apparatus for coupling light from an array of optoelectronic devices to a corresponding array of fibers contained in a fiber optic ferrule is disclosed. The fibers may be single-mode or multi-mode optical fibers. The method includes fixing the fiber optic ferrule to the optical subassembly (OSA) base upon which the array of optoelectronic devices will be affixed, aligning the array of optoelectronic devices to the corresponding array of fibers, then securing the array of optoelectronic devices to the OSA base. In one embodiment, the module includes an optical subassembly module housing a linear array of 1300 nm VCSELs or photodetectors, spaced apart at a 250 micron pitch to correspond to the spacing of optical fibers in a conventional MT ferrule. The array of optoelectronic devices is mounted on a substrate assembly that includes a weldable surface and one or more photodetectors for automatic power control.

Abstract: A method and apparatus for encapsulating optoelectronic devices provides for accurately positioning and shaping an encapsulant by actively referencing the device die upon which the optoelectronic devices are formed. A molding tool is accurately aligned to the optoelectronic devices in the x, y and &thgr; directions using mechanical guides and is aligned in the z direction by actively referencing the device die. The shaped encapsulant is preferably an angled wedge having a minimum thickness over the optoelectronic devices to provide a high coupling efficiency and an increased thickness in other portions to fully encapsulate wire bond connections, for example. The method also provides for using the mechanical guides to align and couple optical fibers to the optoelectronic devices. In one exemplary embodiment, the end face of the optical fiber forms a conterminous interface with the top surface of the encapsulant, and the interface is obliquely angled with respect to the surface of the device die.

Abstract: A method and apparatus for encapsulating optoelectronic devices provides for accurately positioning and shaping an encapsulant by actively referencing the device die upon which the optoelectronic devices are formed. A molding tool is accurately aligned to the optoelectronic devices in the x, y and &thgr; directions using mechanical guides and is aligned in the z direction by actively referencing the device die. The shaped encapsulant is preferably an angled wedge having a minimum thickness over the optoelectronic devices to provide a high coupling efficiency and an increased thickness in other portions to fully encapsulate wire bond connections, for example. The method also provides for using the mechanical guides to align and couple optical fibers to the optoelectronic devices. In one exemplary embodiment, the end face of the optical fiber forms a conterminous interface with the top surface of the encapsulant, and the interface is obliquely angled with respect to the surface of the device die.

Abstract: A multilayer ceramic carrier for an optical element includes a terraced cavity for retaining a vertically receiving or vertically emitting optical element. The multilayer ceramic carrier includes conductive traces interposed between the ceramic layers and which extend into the terraced cavity along the trenches formed in the cavity. A vertical cavity surface emitting laser or vertically receiving optical element is wire bonded to the conductive traces which extend into the cavity. In one embodiment, the terraced cavity of the multilayer ceramic carrier includes a VCSEL and photodetector therein, the photodetector capable of monitoring the output optical power of the VCSEL. The method for forming the multilayer ceramic carrier includes forming a plurality of layers of ceramic tape, joining the layers, then co-firing the stacked layers. The multilayer ceramic carrier is joined to a plastic optical housing which includes an aperture for securing an optical fiber.

Abstract: A coupling system for transferring fluids from a medicament-containing cartridge to an injection site comprises a fluid flow channel, a blunt cannula defining the distal end of the fluid flow channel, a needle cannula defining the proximal end of the fluid flow channel, and means for fixedly connecting the needle cannula to the blunt cannula.

Abstract: An article of manufacture adapted to be connected to a male thread comprises an exterior surface, a cavity opening away from the exterior surface and defining an interior surface, and a plurality of ribs disposed on the interior surface extending longitudinally away from the exterior surface. The article can be connected to the male thread by threading the cavity onto the male thread. It is a particular advantage that the article of this invention, unlike prior art female threaded articles, can be prepared by conventional simple injection molding techniques not requiring an unscrewing step. In one preferred embodiment, the article is a plunger rod intended to be connected to the male threaded post of a plunger of an associated cartridge-needle unit to form a syringe assembly.