Abstract: A microelectromechanical device has a movable first electrode and stationary second and third electrodes oriented parallel with the substrate. The first electrode is separated from the substrate and includes a first hinge oriented parallel to the substrate, with spaced apart extensions extending from opposing sides of the first electrode. The second and third electrodes are fixedly formed on the substrate adjacent to the opposing sides of the first electrode and have spaced apart extensions interspersed with the spaced apart extensions of the first electrode. The first electrode can move substantially parallel to the surface of the substrate such that the extensions of one side of the first electrode substantially overlap the extensions of the second electrode in a first state and the extensions of the other side of the first electrode substantially overlaps the extensions of the third electrode in a second state.

Abstract: A microelectromechanical device has a movable first electrode and stationary second and third electrodes oriented parallel with the substrate. The first electrode is separated from the substrate and includes a first hinge oriented parallel to the substrate, with spaced apart extensions extending from opposing sides of the first electrode. The second and third electrodes are fixedly formed on the substrate adjacent to the opposing sides of the first electrode and have spaced apart extensions interspersed with the spaced apart extensions of the first electrode. The first electrode can move substantially parallel to the surface of the substrate such that the extensions of one side of the first electrode substantially overlap the extensions of the second electrode in a first state and the extensions of the other side of the first electrode substantially overlaps the extensions of the third electrode in a second state.

Abstract: A method and system in which a semiconductor wafer having a plurality of dies is inspected through a visual inspection and/or an electrical test. If certain of the dies on the wafer pass the inspection, then windows are mounted or affixed above those certain dies while they are still a part of the wafer.

Abstract: An improved microelectromechanical systems (MEMS) device, which eliminates, or at least reduces, “stiction” is described. The MEMS device includes a central electrode and a pair of outer electrodes formed on a substrate. The central electrode includes a plurality of extensions defining a plurality of grooves interspersed with the extensions. The outer electrodes include a plurality of extensions disposed within the grooves of the central electrode.

Abstract: A method and system in which a semiconductor wafer having a plurality of dies is inspected through a visual inspection and/or an electrical test. If certain of the dies on the wafer pass the inspection, then windows are mounted or affixed above those certain dies while they are still a part of the wafer.