Abstract: A curable adhesive composition kit and method of adhering substrates is provided having three basic adhesives and up to three additional optional adhesives. The basic adhesives include: at least one curable silicone end group-containing adhesive; at least one curable cyanoacrylate adhesive, and at least one curable epoxy adhesive. The optional adhesives can be one or more of the following: contact adhesive, urethane adhesive, polyvinylacetate adhesive, and pressure sensitive adhesive. The kit system also can have a selection guide for the adhesives in the system based on substrate types or substrate types and use conditions. Optionally a guide for using the adhesives in repairing adherends can be included in the kit. Also optionally the selection guide and/or the repair guide can be in an interactive program on a web site on a computer network such as the internet.

Abstract: The present invention relates to an adhesive and more particularly to a moisture curable adhesive. In one embodiment, the present invention includes a moisture curable adhesive comprising a polymer or copolymer including reactive silicon end groups; from about 0.01 to about 40 percent by weight of a clear filler that will not substantially interfere with the clarity of the adhesive; and from about 0.01 to about 10 percent by weight of a dehydrating agent. In another embodiment, the present invention includes a moisture curable adhesive comprising a copolymer including a reactive silicon group; from about 33 to about 85 percent by weight of a filler; and from about 0.01 to about 10 percent by weight of a dehydrating agent. The present invention is further directed to a method of joining two adherends.

Abstract: A curable adhesive composition kit and method of adhering substrates is provided having three basic adhesives and up to three additional optional adhesives. The basic adhesives include: at least one curable silicone end group-containing adhesive; at least one curable cyanoacrylate adhesive, and at least one curable epoxy adhesive. The optional adhesives can be one or more of the following: contact adhesive, urethane adhesive, polyvinylacetate adhesive, and pressure sensitive adhesive. The kit system also can have a selection guide for the adhesives in the system based on substrate types or substrate types and use conditions. Optionally a guide for using the adhesives in repairing adherends can be included in the kit. Also optionally the selection guide and/or the repair guide can be in an interactive program on a web site on a computer network such as the internet.

Abstract: The present invention relates to an adhesive and more particularly to a moisture curable adhesive. In one embodiment, the present invention includes a moisture curable adhesive comprising a polymer or copolymer including reactive silicon end groups; from about 0.01 to about 40 percent by weight of a clear filler that will not substantially interfere with the clarity of the adhesive; and from about 0.01 to about 10 percent by weight of a dehydrating agent. In another embodiment, the present invention includes a moisture curable adhesive comprising a copolymer including a reactive silicon group; from about 33 to about 85 percent by weight of a filler; and from about 0.01 to about 10 percent by weight of a dehydrating agent. The present invention is further directed to a method of joining two adherends.