Abstract: Embodiments are generally directed to a method and apparatus to couple a module to a management controller on an interconnect. In one embodiment, a method includes detecting that a module has coupled to an interconnect, the interconnect coupled to a modular platform backplane. The method further includes logically coupling the module to one of a plurality of management controllers resident on the interconnect, each management controller logically appears as a management controller for different interconnects coupled to the modular platform backplane.

Abstract: Generally, the present invention is directed to marketing techniques and more particularly to direct-to-patient marketing for medical devices, pharmaceutical drugs, and biotechnology products. The approach presented here may also be applied to the recruitment of patients for clinical trials evaluation including tracking outcomes after treatment. An embodiment of the invention includes the steps of finding potential patients, qualifying potential patients, connecting potential patients to preferred physicians, and tracking the patient's progress through the appointment phase and tracking outcomes.

Abstract: Generally, the present invention is directed to marketing techniques and more particularly to direct-to-patient marketing for medical devices, pharmaceutical drugs, and biotechnology products. The approach presented here may also be applied to the recruitment of patients for clinical trials evaluation including tracking outcomes after treatment. An embodiment of the invention includes the steps of finding potential patients, qualifying potential patients, connecting potential patients to preferred physicians, and tracking the patient's progress through the appointment phase and tracking outcomes.

Abstract: One or more components on one or more circuit boards in a chassis may be configured and/or oriented such that the component(s) are aligned with a diagonal predominant air flow path through the chassis. In one embodiment, components may be mounted on a circuit board with a skewed orientation that aligns the components with the predominant air flow path. In another embodiment, one or more heat sinks may include angled fins that are aligned with the predominant air flow path. Of course, many alternatives, variations, and modifications are possible without departing from this embodiment.

Abstract: A method and apparatus to couple a rear transition module to a carrier board includes detecting a rear transition module (RTM) coupled to an interface resident on a carrier board, the carrier board coupled to a backplane. The method further includes logically coupling the RTM to a management controller resident on the carrier board and managing the RTM in a same manner as a front accessible module coupled to another interface resident on the carrier board.

Abstract: A battery and battery condition indicator are provided with a seal as monolithic structures whereby the indicator is inserted in an opening in the battery and sealed there against via ribs in the battery confronted by a surface of the indicator and/or ribs on the indicator embedded in a surface of the battery defining the opening.

Abstract: A method of detecting lint in a clothes dryer is disclosed. Light is directed through a surface within the clothes dryer, the light being emitted by a light source. The light is received at a photocell if the light is reflected off the surface when lint covers the surface. An indication is provided that lint is present within the clothes dryer if light is received at the photocell. Furthermore, a voltage level detector is positioned within the lint detector and determined if a threshold amount of light is received. In another aspect, if the threshold amount of light is received a warning light, an audio speaker, or an electrical output can be activated. Likewise, the clothes dryer can be automatically shut down. In another aspect, the photocell is a phototransistor. In another aspect, the photocell is a photoresistor.

Abstract: A two-dimensional adjustable edge connector adaptor to support high bandwidth signal paths. The edge connector adapter includes a housing having a cavity formed in one side and an edge connector extending outward from an opposing side. The edge connector includes contact members that are configured to function as conventional edge connector contacts on one end, while the opposing end includes a leg that is in contact with first side of an elastomer connector disposed in the cavity. The elastomer connector facilitates electrical coupling between each contact member and a corresponding board contact on a board having a connector edge that is inserted into the cavity, wherein each board contact includes a leg that is in contact with a second side of the elastomer connector. The adjustable edge connector adaptor enables the board to be positioned in both the horizontal and vertical directions relative to the edge connector.

Abstract: A shock absorbing system may be mounted on a circuit board, such as a carrier card, to reinforce the circuit board and/or to absorb shock forces from a neighboring circuit board, such as a mezzanine card coupled to the carrier card. The shock absorbing system may include one or more support members extending across at least a portion of the carrier card. One or more rollers may be supported on the support member(s) in a manner that allows rotation to facilitate insertion and/or extraction of mezzanine cards from the carrier card. Of course, many alternatives, variations, and modifications are possible without departing from this embodiment.

Abstract: Rotating latching mechanism for securing Advanced Telecom Computing Architecture (ATCA) mezzanine card (AdvancedMC) modules within mezzanine slots on an ATCA carrier board. The rotating latching mechanism includes a rotating latching member having a handle coupled to a shaft to which a latching paddle and position detector actuator paddle are also coupled. The rotating latching member is pivotally coupled relative to a faceplate of a module proximate to the handle, and the shaft at the opposite end is supported by a rear bearing support member coupled to the modules circuit card. As the handle is rotated, the latching paddle is rotated to engage a cutout formed in a strut coupled to the ATCA carrier board, thus latching the module in place. The position detector actuator paddle is also rotated to cause a position detector to be actuated.

Abstract: A folding latching mechanism and related structure. An embodiment of the folding latching mechanism includes a latch member having a claw-shaped clasp disposed proximate to a pivot member that enables a pivotal coupling about a first pivot axis. A lever arm is pivotally-coupled to the latch member about a second pivot (fold) axis that is perpendicular to the first pivot axis of the latch member. During use, the latch member is rotated about its first pivot axis via the lever arm in an extended position, whereby the latching member is securely coupled to a frame member via its clasp. The lever arm is then rotated about its fold axis and secured in place. The folding latching mechanism may be employed on an Advanced Telecom Computing Architecture (ATCA) board hosting one or more Advanced Mezzanine Card (AdvancedMC) modules, wherein the mechanism does not interfere with the I/O port interfaces for the modules.

Abstract: A method according to one embodiment may include providing a heat generating component disposed on a first side of a first circuit board, and transferring heat from the heat generating component through the first circuit board to a second side of the first circuit board. The method according to this embodiment may further include slidingly thermally coupling the second side of the first circuit board to a thermal solution disposed on a second circuit board. Of course, many alternatives, variations, and modifications are possible without departing from this embodiment.

Abstract: A method and apparatus to couple a rear transition module to a carrier board includes detecting a rear transition module (RTM) coupled to an interface resident on a carrier board, the carrier board coupled to a backplane. The method further includes logically coupling the RTM to a management controller resident on the carrier board and managing the RTM in a same manner as a front accessible module coupled to another interface resident on the carrier board.

Abstract: Embodiments of the invention are generally directed to a connector. In one embodiment, the connector includes a plurality of flexible circuit partitions and a first mating portion to receive and couple a contact for a device to a first end of one or more flexible circuit partitions. The connector also includes a second mating portion to receive and couple a contact for another device to a second end of the one or more flexible circuit partitions. A connector housing is connected to the other device to contain the first and second mating portions. Each flexible circuit partition further includes a twist to increase a range of movement along three axes of movement in which the first mating portion receives and couples the device's contact to the first end of one or more flexible circuit partitions without a proportional increase in movement of either end of each flexible circuit partition.

Abstract: A method of detecting lint in a clothes dryer is disclosed. Light is directed through a surface within the clothes dryer, the light being emitted by a light source. The light is received at a photocell if the light is reflected off the surface when lint covers the surface. An indication is provided that lint is present within the clothes dryer if light is received at the photocell. Furthermore, a voltage level detector is positioned within the lint detector and determined if a threshold amount of light is received. In another aspect, if the threshold amount of light is received a warning light, an audio speaker, or an electrical output can be activated. Likewise, the clothes dryer can be automatically shut down. In another aspect, the photocell is a phototransistor. In another aspect, the photocell is a photoresistor.

Abstract: Embodiments are generally directed to a method and apparatus to couple a module to a management controller on an interconnect. In one embodiment, a method includes detecting that a module has coupled to an interconnect, the interconnect coupled to a modular platform backplane. The method further includes logically coupling the module to one of a plurality of management controllers resident on the interconnect, each management controller logically appears as a management controller for different interconnects coupled to the modular platform backplane.

Abstract: A light transmissive body for a fluid condition indicator has a substantial length shaped as a cruciform in transverse cross-section.

Abstract: An integrated heatsink and core power distribution mechanism. First and second power rails are disposed on opposite sides of one of more integrated circuits on a printed circuit board (PCB). The power rails are electrically coupled to a power supply and the integrated circuits. At the same time, the power rails are used to thermally couple one or more heatsinks to the integrated circuit(s). Each power rails includes at least one slot configured to receive a flange on the heatsink(s). In situations under which different voltages are supplied via the power rails, means are provided to electrically insulate at least one power rail from the heatsink(s) while maintaining thermal coupling to the power rails. In one embodiment, a split-rail configuration is used, wherein the power rail includes multiple conductive sections separated by one or more insulator sections. The scheme is well-suited for modular board/blade architectures, such as the Advanced Telecommunications Architecture (ATCA).

Abstract: A water filter assembly comprising a water filter arrangement and a water cooling arrangement in an integral unit. The cooling arrangements are concentrically configured with the cooling arrangement surrounding the filter arrangement.

Abstract: A thermal management apparatus is provided, wherein heat generated by an electronic component coupled to a backside of a carrier substrate may be transferred to an opposite front side of the carrier substrate through a thermal conductor sized to pass through an opening in the carrier substrate.