Patents by Inventor Mark Sussman

Mark Sussman has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20260223280
    Abstract: An apparatus, system and method for a high current printed electronics cable assembly. The embodiments include; at least two flexible substrates; at least one conductive trace printed on at least one of a top face or a bottom face of each of the at least two flexible substrates; an insulator substantially covering the at least one conductive trace printed on each of the at least two flexible substrates, wherein an exposed end of the at least one conductive trace is uninsulated on at least one end of each of the at least two flexible substrates; a conductive foil placed over and electrically connected with the at least one conductive trace at the uninsulated exposed end; and a conductive element passing through the conductive foil to provide electrical connectivity to the at least one conductive trace on distinct ones of the at least two flexible substrates.
    Type: Application
    Filed: January 10, 2024
    Publication date: July 30, 2026
    Inventors: ED Collins, Mark Sussman
  • Publication number: 20240431038
    Abstract: The disclosure is and includes at least an apparatus, system and method printing multilayer circuits on graphics. The multilayer print may include forming an electronic human machine interface, sensor readout, or a driver circuit, by way of example, and may include successively printing at least two functional ink layers comprising at least one conductive layer and at least one dielectric layer on a substrate comprising one of a thermoform and an overmold; printing at least one non-conductive graphical ink layer in the succession of the successively printing; curing each of the successively printed layers after the printing of each of the successively printed layers, wherein the curing of the successively printed functional ink layers comprises at least an ultra-violet curing; and squeegeeing at least the at least one conductive layer with a squeegee having a low durometer.
    Type: Application
    Filed: June 25, 2024
    Publication date: December 26, 2024
    Inventors: Sai Guruva Reddy Avuthu, Nabel Ghalib, Mark Sussman, Arnoldo Reta, Samantha Stevens, Nathaniel Richards, MaryAlice Gill, Girish Wable, Ronald Darnell, Ralph Hugeneck, Jorg Richstein
  • Patent number: 12052832
    Abstract: The disclosure is and includes at least an apparatus, system and method printing multilayer circuits on graphics. The multilayer print may include forming an electronic human machine interface, sensor readout, or a driver circuit, by way of example, and may include successively printing at least two functional ink layers comprising at least one conductive layer and at least one dielectric layer on a substrate comprising one of a thermoform and an overmold; printing at least one non-conductive graphical ink layer in the succession of the successively printing; curing each of the successively printed layers after the printing of each of the successively printed layers, wherein the curing of the successively printed functional ink layers comprises at least an ultra-violet curing; and squeegeeing at least the at least one conductive layer with a squeegee having a low durometer.
    Type: Grant
    Filed: October 24, 2019
    Date of Patent: July 30, 2024
    Inventors: Sai Guruva Reddy Avuthu, Nabel Ghalib, Mark Sussman, Arnoldo Reta, Samantha Stevens, Nathaniel Richards, MaryAlice Gill, Girish Wable, Ronald Darnell, Ralph Hugeneck, Jorg Richstein
  • Publication number: 20240186062
    Abstract: A method for flexible hybrid electronics (FHE) simultaneous printing of a plurality of electrical devices. The method includes providing a flexible substrate having a top surface and a bottom surface and providing vias through the substrate for all of the plurality of electrical devices. The method also includes printing circuit elements for the plurality of devices on the top surface of the substrate using a conductive ink, and printing circuit elements for the plurality of devices on the bottom surface of the substrate using the conductive ink, where printing the circuit elements on the top and bottom surfaces of the substrate causes the ink to flow through the vias to provide an electrical connection between the circuit elements on the top and bottom surfaces.
    Type: Application
    Filed: April 19, 2022
    Publication date: June 6, 2024
    Inventors: NATHANIEL RICHARDS, SAI AVUTHU, MARK SUSSMAN, SAMANTHA STEVENS, ARNOLD RETA, NABEL GHALIB, BEN LIESEGANG, JÖRG RICHSTEIN, ED COLLINS
  • Publication number: 20220007520
    Abstract: The disclosure is and includes at least an apparatus, system and method printing multilayer circuits on graphics. The multilayer print may include forming an electronic human machine interface, sensor readout, or a driver circuit, by way of example, and may include successively printing at least two functional ink layers comprising at least one conductive layer and at least one dielectric layer on a substrate comprising one of a thermoform and an overmold; printing at least one non-conductive graphical ink layer in the succession of the successively printing; curing each of the successively printed layers after the printing of each of the successively printed layers, wherein the curing of the successively printed functional ink layers comprises at least an ultra-violet curing; and squeegeeing at least the at least one conductive layer with a squeegee having a low durometer.
    Type: Application
    Filed: October 24, 2019
    Publication date: January 6, 2022
    Applicant: JABIL INC.
    Inventors: Sai Guruva Reddy Avuthu, Nabel Ghalib, Mark Sussman, Arnoldo Reta, Samantha Stevens, Nathaniel Richards, MaryAlice Gill, Girish Wable, Ronald Darnell, Ralph Hugeneck, Jorg Richstein