Abstract: A binder assembly comprises a binder and leaves which are randomly removable therefrom. The leaves may be removed only by a sidewise shifting movement. Blocking portions are movably mounted on the device selectively to permit or prohibit sidewise movement of the leaves.

Abstract: This invention relates to a connector device, and more particularly to an electrical connector plug, jack, tapping device or receptacle which provides a direct current path between an input and an output terminal, which path is automatically opened responsive to the insertion of a fuse, after which the sole conductive path between the terminals extends through the fuse.

Abstract: The present invention relates to a pilfer prevention device adapted to be readily connected between an article to be secured, such as a television set, typewriter, etc. and a fixed location so as to discourage unauthorized removal. The device includes a mounting assembly readily connectible to the article, an elongate cable assembly extending therefrom, and a mounting fixture adapted to be connected to a desk, table or like fixed object. The device is characterized by lockable release means on the mounting assembly which, in the locked position, prevents access to the fastening means by which the apparatus is connected to the fixed object and to the article to be protected.

Abstract: The present invention relates to a desoldering tool or device especially intended for desoldering electrical connections of the type used for supporting components in printed circuit boards. The device includes a heating element for melting the solder connection by contact therewith and a vibrating mechanism which relatively moves the two conductive elements defining the connection during the course of cooling of the melted joint whereby, upon completion of cooling, the component is essentially free of mechanical connection to its former receptacle. The invention further relates to the method of desoldering which involves melting a soldered connection and relatively vibrating the theretofore connected components during cooling of the solder, especially by pressure exerted on one of the connectors by a vibratable heating member.