Patents by Inventor Mark T. Chisa

Mark T. Chisa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10141656
    Abstract: A structural antenna array may include a core including intersecting wall sections, wherein the core further includes antenna elements formed on a first surface of the wall sections, and feed elements formed on a second surface of the wall sections, a distribution substrate layer coupled to the core and in electrical communication with the antenna elements and the feed elements, a first skin coupled to the core opposite the distribution substrate layer, and a second skin coupled to the distribution substrate layer opposite the first skin.
    Type: Grant
    Filed: January 6, 2016
    Date of Patent: November 27, 2018
    Assignee: The Boeing Company
    Inventors: Manny S. Urcia, Matthew A. Stoneback, Tiffany M. Radford, Mark T. Chisa, Mark A. Thompson, Benjamin D. Smith, Charles W. Manry, Jr.
  • Publication number: 20170194715
    Abstract: A structural antenna array may include a core including intersecting wall sections, wherein the core further includes antenna elements formed on a first surface of the wall sections, and feed elements formed on a second surface of the wall sections, a distribution substrate layer coupled to the core and in electrical communication with the antenna elements and the feed elements, a first skin coupled to the core opposite the distribution substrate layer, and a second skin coupled to the distribution substrate layer opposite the first skin.
    Type: Application
    Filed: January 6, 2016
    Publication date: July 6, 2017
    Inventors: Manny S. Urcia, Matthew A. Stoneback, Tiffany M. Radford, Mark T. Chisa, Mark A. Thompson, Benjamin D. Smith, Charles W. Manry, JR.
  • Patent number: 7579997
    Abstract: A system and method of constructing a phased array antenna system that incorporates a printed wiring board assembly with a metallic waveguide plate is provided. The system uses a metallic waveguide plate to dissipate heat toward and through the waveguide portion of the system.
    Type: Grant
    Filed: October 3, 2007
    Date of Patent: August 25, 2009
    Assignee: The Boeing Company
    Inventors: Julio A. Navarro, Richard N. Bostwick, Mark T. Chisa, Omer C. Helfer
  • Publication number: 20090091506
    Abstract: A system and method of constructing a phased array antenna system that incorporates a printed wiring board assembly with a metallic waveguide plate is provided. The system uses a metallic waveguide plate to dissipate heat toward and through the waveguide portion of the system.
    Type: Application
    Filed: October 3, 2007
    Publication date: April 9, 2009
    Inventors: Julio A. Navarro, Richard N. Bostwick, Mark T. Chisa, Omer C. Helfer