Patents by Inventor Mark T. Kosmowski

Mark T. Kosmowski has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8735774
    Abstract: A laser beam propagates along a beam axis for incidence on a work surface mounted on a support. The support operatively connects to a positioning system moving at least one of the laser beam and the target specimen relative to each other to position the laser beam at selected locations on the work surface. At least one force reaction compensation motor is located in a common force plane with, and as close as possible to, a corresponding stage motor. Any moment arm between the compensation motor and the corresponding stage motor is reduced or eliminated, allowing the compensation motor to directly couple and react to stage forces with virtually zero moment arm. Six degrees of freedom can be controlled with only four motors, since each compensation motor is directly coupled and aligned to a corresponding stage motor.
    Type: Grant
    Filed: July 28, 2009
    Date of Patent: May 27, 2014
    Assignee: Electro Scientific Industries, Inc.
    Inventor: Mark T. Kosmowski
  • Patent number: 8461482
    Abstract: A process and apparatus neutralizes a warp effect resulting from a build up of micro strains caused by machining a part with a long wavelength laser. The part to be machined is pre-stressed in an opposite direction of a warp stress due to machining using a fixture for holding the part without yielding any other features in the part. The part is machined while held in the pre-stressed position in the fixture.
    Type: Grant
    Filed: June 12, 2009
    Date of Patent: June 11, 2013
    Assignee: Electro Scientific Industries, Inc.
    Inventors: Mark T. Kosmowski, Mehmet E. Alpay
  • Patent number: 8461480
    Abstract: An orthogonal integrated cleaving apparatus and methods of controlling such an apparatus are taught. The cleaving apparatus includes two cleaving devices mounted at right angles with respect to a mount facing a substrate to be processed. The non-metallic and/or brittle substrate is separated along two orthogonal axes without rotating or moving the substrate to a second machine by moving the mount or the substrate along the axes. Each cleaving device laser sequentially heats a surface of the substrate along a respective cutting axis, cools the cut area and then laser re-heats the cut area to form a clean break.
    Type: Grant
    Filed: November 30, 2010
    Date of Patent: June 11, 2013
    Assignee: Electro Scientific Industries, Inc.
    Inventors: Mark T. Kosmowski, Mehmet E. Alpay
  • Patent number: 8207472
    Abstract: A method of capturing and removing metallic debris created on a target side of a target metal specimen undergoing laser micromachining entails providing a barrier that encompasses the immediate volume surrounding a laser cutting head output nozzle to contain the ejected debris and extracting the debris through a vacuum outlet. A preferred system implementing this approach to debris management includes a barrier in the form of a flexible fiber brush configured in the shape of a ring and positioned to trap ejected debris within a localized area surrounding a target area where the laser beam is incident on the target metal specimen. The ring brush is made of material that is robust to molten metals. An inert gas directed at a high flow rate along the target surface of the metal specimen carries ejected surface debris trapped in the ring brush toward a vacuum outlet.
    Type: Grant
    Filed: December 2, 2008
    Date of Patent: June 26, 2012
    Assignee: Electro Scientific Industries, Inc.
    Inventor: Mark T. Kosmowski
  • Publication number: 20120132628
    Abstract: An orthogonal integrated cleaving apparatus and methods of controlling such an apparatus are taught. The cleaving apparatus includes two cleaving devices mounted at right angles with respect to a mount facing a substrate to be processed. The non-metallic and/or brittle substrate is separated along two orthogonal axes without rotating or moving the substrate to a second machine by moving the mount or the substrate along the axes. Each cleaving device laser sequentially heats a surface of the substrate along a respective cutting axis, cools the cut area and then laser re-heats the cut area to form a clean break.
    Type: Application
    Filed: November 30, 2010
    Publication date: May 31, 2012
    Applicant: ELECTRO SCIENTIFIC INDUSTRIES, INC.
    Inventors: Mark T. Kosmowski, Mehmet E. Alpay
  • Patent number: 7886449
    Abstract: A laser processing system in which a laser beam propagates along a beam axis and through a lens for incidence on a work surface of a target specimen mounted on a support. The lens forms a focal region of the laser beam. The support is operatively connected to a multiple-axis positioning system that moves the laser beam and the target specimen relative to each other to position the laser beam at selected locations on the work surface. An assembly includes at least one flexure that supports the lens and guides movement of the lens along the beam axis in response to a motive force to adjust the focal region of the laser beam relative to the work surface.
    Type: Grant
    Filed: February 27, 2009
    Date of Patent: February 15, 2011
    Assignee: Electro Scientific Industries, Inc.
    Inventor: Mark T. Kosmowski
  • Patent number: 7889322
    Abstract: A specimen inspection stage implemented with a processing stage coupling mechanism provides a capability to conduct with maximum efficiency post-processing specimen inspections on-board a processing platform. Heavy inspection equipment is mounted on a specimen inspection stage that is separate from a processing stage. In a preferred embodiment, the processing stage moves in response to an applied motive force and performs laser-based processing operations on a specimen. While laser processing is ongoing, the specimen inspection stage remains parked in its home position. When it is time for post-processing inspection, a stage coupling and decoupling mechanism couples together the specimen inspection stage and the processing stage, which transports the specimen inspection stage to and from the specimen position.
    Type: Grant
    Filed: May 10, 2007
    Date of Patent: February 15, 2011
    Assignee: Electro Scientific Industries, Inc.
    Inventors: Mark T. Kosmowski, Robert Ferguson, Jeremy Willey
  • Publication number: 20100243617
    Abstract: A via drilling system is preferably constructed to process one target at a time. The via drilling system preferably provides a relatively small footprint for the via drilling system, relatively small moment arms between via drilling system components, a relatively short stiffness loop, and a relatively fast processing time for a target. Multiple tools are preferably provided to perform multiple operations substantially simultaneously on the target.
    Type: Application
    Filed: March 26, 2009
    Publication date: September 30, 2010
    Applicant: Electro Scientific Industries, Inc.
    Inventor: Mark T. Kosmowski
  • Patent number: 7760331
    Abstract: A split axis stage architecture is implemented as a multiple stage positioning system that is capable of vibrationally and thermally stable material transport at high speed and rates of acceleration. A split axis design decouples stage motion along two perpendicular axes lying in separate, parallel planes. A dimensionally stable substrate in the form of a granite, or other stone slab, or of ceramic material or cast iron, is used as the base for lower and upper stages. The substrate is precisely cut (“lapped”) such that its upper and lower stage surface portions are flat and parallel to each other.
    Type: Grant
    Filed: February 20, 2007
    Date of Patent: July 20, 2010
    Assignee: Electro Scientific Industries, Inc.
    Inventors: Mark T. Kosmowski, Kelly Bruland
  • Publication number: 20090314754
    Abstract: A process and apparatus neutralizes a warp effect resulting from a build up of micro strains caused by machining a part with a long wavelength laser. The part to be machined is pre-stressed in an opposite direction of a warp stress due to machining using a fixture for holding the part without yielding any other features in the part. The part is machined while held in the pre-stressed position in the fixture.
    Type: Application
    Filed: June 12, 2009
    Publication date: December 24, 2009
    Applicant: ELECTRO SCIENTIFIC INDUSTRIES, INC.
    Inventors: Mark T. Kosmowski, Mehmet E. Alpay
  • Publication number: 20090314753
    Abstract: A method of capturing and removing metallic debris created on a target side of a target metal specimen undergoing laser micromachining entails providing a barrier that encompasses the immediate volume surrounding a laser cutting head output nozzle to contain the ejected debris and extracting the debris through a vacuum outlet. A preferred system implementing this approach to debris management includes a barrier in the form of a flexible fiber brush configured in the shape of a ring and positioned to trap ejected debris within a localized area surrounding a target area where the laser beam is incident on the target metal specimen. The ring brush is made of material that is robust to molten metals. An inert gas directed at a high flow rate along the target surface of the metal specimen carries ejected surface debris trapped in the ring brush toward a vacuum outlet.
    Type: Application
    Filed: December 2, 2008
    Publication date: December 24, 2009
    Applicant: Electro Scientific Industries, Inc.
    Inventor: Mark T. Kosmowski
  • Patent number: 7603785
    Abstract: A rigid support structure allows for faster and more accurate positioning of axially adjustable optical components in a laser processing system. Vibrational and thermal stability is improved when an optics assembly is housed in a rigid air bearing sleeve that is mounted to a support structure above a specimen stage.
    Type: Grant
    Filed: February 20, 2007
    Date of Patent: October 20, 2009
    Assignee: Electro Scientific Industries, Inc.
    Inventor: Mark T. Kosmowski
  • Publication number: 20080196631
    Abstract: A split axis stage architecture is implemented as a multiple stage positioning system that is capable of vibrationally and thermally stable material transport at high speed and rates of acceleration. A split axis design decouples stage motion along two perpendicular axes lying in separate, parallel planes. A dimensionally stable substrate in the form of a granite, or other stone slab, or of ceramic material or cast iron, is used as the base for lower and upper stages. The substrate is precisely cut (“lapped”) such that its upper and lower stage surface portions are flat and parallel to each other.
    Type: Application
    Filed: February 20, 2007
    Publication date: August 21, 2008
    Inventors: Mark T. Kosmowski, Kelly Bruland
  • Publication number: 20080198373
    Abstract: A specimen inspection stage implemented with a processing stage coupling mechanism provides a capability to conduct with maximum efficiency post-processing specimen inspections on-board a processing platform. Heavy inspection equipment is mounted on a specimen inspection stage that is separate from a processing stage. In a preferred embodiment, the processing stage moves in response to an applied motive force and performs laser-based processing operations on a specimen. While laser processing is ongoing, the specimen inspection stage remains parked in its home position. When it is time for post-processing inspection, a stage coupling and decoupling mechanism couples together the specimen inspection stage and the processing stage, which transports the specimen inspection stage to and from the specimen position.
    Type: Application
    Filed: May 10, 2007
    Publication date: August 21, 2008
    Applicant: Electro Scientific Industries, Inc.
    Inventors: Mark T. Kosmowski, Robert Ferguson, Jeremy Willey
  • Publication number: 20080198485
    Abstract: A rigid support structure allows for faster and more accurate positioning of axially adjustable optical components in a laser processing system. Vibrational and thermal stability is improved when an optics assembly is housed in a rigid air bearing sleeve that is mounted to a support structure above a specimen stage.
    Type: Application
    Filed: February 20, 2007
    Publication date: August 21, 2008
    Inventor: Mark T. Kosmowski