Abstract: A method of testing a planar lightwave circuit is achieved by coupling an optical probe to the planar lightwave circuit. In one embodiment, a second probe is used in combination with the first probe to test the planar lightwave circuit by sending and receiving a light beam through the planar lightwave circuit.

Abstract: A method of testing a planar lightwave circuit is achieved by coupling an optical probe to the planar lightwave circuit. In one embodiment, a second probe is used in combination with the first probe to test the planar lightwave circuit by sending and receiving a light beam through the planar lightwave circuit.

Abstract: A method of testing a planar lightwave circuit is achieved by coupling an optical probe to the planar lightwave circuit. In one embodiment, a second probe is used in combination with the first probe to test the planar lightwave circuit by sending and receiving a light beam through the planar lightwave circuit.

Abstract: A method and apparatus for inviting individuals to events comprising audio and visual data that is stored and distributed on electronic storage media. The data comprises a basic invitation and additional desired information, including the time and date of the event as well as directions to the event location. Once completed, the invitation is enclosed in a mail-safe case and delivered to the prospective guests. The invitation is operable on a CD player, which translates the data into audible information for the guest. The invitation is also operable on a guest-operated interface, which can be used to view photo and/or graphic art images included by the event host. In a further embodiment of the method and apparatus, an RSVP prompt is provided along with the invitation data. The guest uses the guest-operated interface to transmit the guest's response to the host via the Internet or some other network connection.

Abstract: Electronic devices having at least two components with mating contact pads are provided with high-aspect-ratio solder joints between the mating pads. These joints ar formed by placing a composite solder medium containing solder wires in an electrically insulating matrix such that at least two solder wires are in contact with the mating pads, and fusing the wires to the pads. The insulating matrix with remainder of solder wires is then optionally removed from between the said at least two components. The composite solder medium is formed by preparing an elongated body of solder wires in an insulating matrix and cutting off slices of the composite solder medium, the solder wires having a high-aspect-ratio of length to their diameter. Alternatively sheets of the composite solder medium are prepared by magnetically aligning solder coated magnetic particles into columns arranged transverse of an insulating matrix and heating sufficiently to fuse the solder in each column into a continuously conducting solder path.

Abstract: In accordance with the invention, an electronic device having one or more contact pads is adhered to an array of transferable solder particles on a removable carrier sheet. The carrier is removed, as by dissolving, leaving solder selectively adhered to the contact pads. In a preferred embodiment the solder-carrying medium is water soluble, and the solder particles comprise solder-coated magnetic particles. Application of a magnetic material while the medium is drying or curing, produces a regular array of solder-coated particles. Using this method, devices having smaller than conventional contact structures can be readily interconnected.

Abstract: We have made the surprising discovery that small amounts of Ag below 1% by weight are effective in making Bi--Sn alloys less strain-rate sensitive without deleteriously affecting the melting character of the alloy. A Pb-free solder composition comprising at least 40% by weight Bi, between 40% and 60% Sn, and between 0.05 and 1% Ag is effective to increase the total elongation of the solder by at least 20% under the same processing conditions. Moreover the solder is free of undesirable Ag-containing phases with a melting point in excess of the 183.degree. C. melting point of the Pb--Sn binary eutectic alloy. In a preferred embodiment, the composition comprises 54.75% Bi, 45% Sn, and 0.25 % Ag.

Abstract: Metals useful in the formation of hydrides for applications such as batteries are advantageously activated by hydriding/dehydriding process. This process involves repeatedly stepping the potential of metal/metal hydride electrodes in electrochemical cells. The process activates hydrogen-storing materials that are difficult to activate by conventional means.

Abstract: A magnetoresistance ratio of 200% (absolute value) or more at room temperature in a field of 6T can be achieved in a layer of material of nominal composition XMnO.sub.y (X is La and at least one of Ca, Sr and Ba, y in the range 2-3.5), if, after formation of the layer, the layer is heat treated in an oxygen-rich (O.sub.2 partial pressure greater than that of air) atmosphere, typically in flowing O.sub.2. The temperature and duration of the heat treatment are in the range 300.degree.-850.degree.C. and 10 minutes-12 hours, and are selected to result in the desired ratio of 200% or more.

Abstract: Materials of composition La.sub.v X.sub.w M.sub.y Mn.sub.z O.sub.x, with x selected from Mg, Sc, Al, Zn, Cd, In and the rare earths that have an ionic radius smaller than that of La, with M selected from Ca, Sr, Ba and Pb, and with v, w, y, z and x in the ranges 0.45-0.85, 0.01-0.20, 0.20-0.45, 0.7-1.3 and 2.5-3.5, respectively, can have substantially improved magnetoresistance (MR) ratios, as compared to the corresponding X-free comparison material. In particular, the novel materials in polycrystalline (or non-epitaxial thin film) form can have relatively large MR ratios. For instance, polycrystalline La.sub.0.60 Y.sub.0.07 Ca.sub.0.33 MnO.sub.x had a peak MR ratio in excess of 10,000% (in absolute value) in a field of 6 T.

Abstract: Pb-free solder alloys based on the Sn-In-Zn system (exemplarily 86:5:9 weight %) are disclosed. Compositions can have a melting temperature in the range 183.degree. C..+-.10.degree. C. and thus can be readily substituted for conventional 40 Pb-60 Sn solder. The novel compositions also can possess superior mechanical properties, compared to the 40/60 Pb-Sn composition, and readily wets copper. Bi and/or Sb may be added to the Sn-In-Zn base to reduce the tendency for the formation of lower temperature phases.

Abstract: In accordance with the present invention, a voltage proportional replication device comprises an input electromagnet responsive to an input voltage for producing a magnetic field in proportion to the input voltage; and a first magnetoresistive sensing element disposed within the field of the input electromagnet. The device further includes an adjustable source of output voltage; an output electromagnet responsive to the output voltage for producing a magnetic field in proportion to the output voltage; and a second magnetoresistive sensing element disposed within the field of the output electromagnet. A control circuit for controlling the adjustable output voltage maintains a constant ratio between the resistances of the first and second magnetoresistive elements, thereby maintaining a constant ratio between the input voltage and the output voltage.

Abstract: Electronic devices having at least two components wire mating contact pads are provided with high-aspect-ratio solder joints between the mating pads. These joints ar formed by placing a composite solder medium containing solder wires in an electrically insulating matrix such that at least two solder wires are in contact with the mating pads, and fusing the wires to the pads. The insulating matrix with remainder of solder wires is then optionally removed from between the said at least two component. The composite solder medium is formed by preparing an elongated body of solder wires in an insulating matrix and cutting off slices of the composite solder medium, the solder wires having a high-aspect-ratio of length to the diameter. Alternatively sheets of the composite solder medium are prepared by magnetically aligning solder coated magnetic particles into columns arranged transverse of an insulating matrix and heating sufficiently to fuse the solder in each column into a continuously conducting solder path.

Abstract: The present inventors have discovered that a compact, highly sensitive current sensor can be made for any inductive component having an air gap in its magnetic path by disposing a layer of magnetoresistive material in the path of the fringing magnetic field. In the preferred embodiment, a thin magnetoresistive film of La.sub.w Ca.sub.x Mn.sub.y O.sub.z on a LaAlO.sub.3 /Al.sub.2 O.sub.3 substrate provides a high sensitivity in the range of 1-100 mV/ampere of DC current in the inductive component. The current sensor consumes a very small amount of power and provides the desirable electrical isolation between the sensor and the active device circuit.

Abstract: In accordance with the invention, a new type of microphone utilizes a magnetoresistive sensing element. Specifically, acoustical energy causes vibrations between a magnetoresistive element and a magnet, producing a variation in the resistance which can be used to convert an acoustical signal into a corresponding electrical signal.

Abstract: We have discovered that the addition of a relatively small amount of Sr and/or Ba to La-Ca-Mn-O can yield material of improved magnetoresistive properties at room temperature and in a small applied field, as compared to the analogous Sr and/or Ba-free material. An exemplary composition is La.sub.0.55 Ca.sub.0.25 Sr.sub.0.08 MnO.sub.x. Material according to the invention has a substantially larger value of .vertline.d.rho./dH.vertline. than the analogous comparison material at 25.degree. C. and H.ltoreq.0.05 Tesla. Preferred compositions also can exhibit a substantially linear dependence of resistivity on applied magnetic field under these conditions, as well as have a relatively large value of zero field resistivity. The novel materials can advantageously be used in applications that involve sensing of a magnetic field, or of changes in such a field.

Abstract: New solder compositions which can have improved mechanical properties are disclosed. In a preferred embodiment, the solder comprises a matrix material and magnetically dispersed particles. A desirable dispersion of the magnetic particles in the matrix material, is accomplished by applying a magnetic field to the molten matrix material containing magnetic particles and solidifying it in the presence of the magnetic field. The particle-dispersed microstructures improve the mechanical properties of the solder composition. The improved solder composition can be made into a powder to be used in solder paste, cream or reshaped while substantially retaining the improved mechanical properties.

Abstract: A diamond body, such as a CVD diamond film, is thinned by placing the body--at an elevated temperature and under pressure--in contact with a molten or partially molten alloy of a rare earth metal and a metallic impurity that lowers the melting point of the rare earth metal. Typically, the rare earth metal is cerium and the impurity is nickel.The pressure is typically less than approximately 0.2 MPa (Mega Pascal), preferably less than approximately 0.02 MPa, and the temperature is within a range whose lower limit is approximately 100 C. degrees below the melting point of the alloy of the rare earth plus impurity metal.