Abstract: Integrated circuit components are imbedded within a laminate substrate disposed on a thermally conductive core, which provides a thermal sink. The circuit components are electrically connected to the integrated circuit via flexible electrical interconnects such as flexible wire bonds. An electrically insulating coating, is deposited upon the flexible electrical interconnects and upon the exposed surfaces of the integrated circuit assembly. The coating provides rigidity, an electrically insulating barrier and a first environmental barrier for preventing contamination of the exposed surfaces of the integrated circuit assembly. A thermally conductive encapsulating material, such as silicon gel, encases the circuit components and the flexible electrical interconnects within a rigid or semi-rigid matrix. The encapsulating material provides additional mechanical support, a second environmental and a thermal sink for dissipation of heat.

Abstract: A method of making circuit boards is disclosed that is suitable for use in a high-volume automated processing plant. The method can be used to produce either single-sided or double-sided circuit boards with access windows allowing electrical access and connection between traces from both sides. In the process, access holes are punched in a coverfilm. A copper sheet having a tin plating on one side is laminated to the coverfilm, with the tin side facing the coverfilm. A pattern representing a circuit is screened on the resulting laminate with a UV-curable resist, developed in a UV dryer, and then the unprotected copper is etched away. The remaining tin is then removed with solder stripping agent, and the resulting circuit is protected with a coverfilm. The process can be applied to large rolls of materials in an automated process, with large numbers of circuits applied to the laminated board. The circuits can then be punched out of the web with a hydraulic press in large numbers.