Abstract: In an approach to determining reliability test strategy, one or more computer processors receive a volume forecast for manufacturing one or more products. The one or more computer processors receive information describing the one or more products. The one or more computer processors retrieve reliability test requirements associated with the one or more products. The one or more computer processors retrieve reliability test capability of one or more reliability test vendors. The one or more computer processors determine, based, at least in part, on the volume forecast, the information describing the one or more products, the reliability test requirements, and the reliability test capability of the one or more reliability test vendors, a reliability test strategy.

Abstract: A mechanism is provided for identifying a wire-pull test location on a wire of a microelectronic package. A first distance between a first terminating location of the wire on the microelectronic package and a second terminating location of the wire on the microelectronic package is determined. Based on the first distance, a second distance from either the first terminating location or the second terminating location is determined as the wire-pull test location for testing a strength of a connection of the wire to at least one of the first terminating location or the second terminating location. An adjustment is performed such that a visual guide is oriented on the wire at the wire-pull test location.

Abstract: In an approach to determining reliability test strategy, one or more computer processors receive a volume forecast for manufacturing one or more products. The one or more computer processors receive information describing the one or more products. The one or more computer processors retrieve reliability test requirements associated with the one or more products. The one or more computer processors retrieve reliability test capability of one or more reliability test vendors. The one or more computer processors determine, based, at least in part, on the volume forecast, the information describing the one or more products, the reliability test requirements, and the reliability test capability of the one or more reliability test vendors, a reliability test strategy.

Abstract: A mechanism is provided for identifying a wire-pull test location on a wire of a microelectronic package. A first distance between a first terminating location of the wire on the microelectronic package and a second terminating location of the wire on the microelectronic package is determined. Based on the first distance, a second distance from either the first terminating location or the second terminating location is determined as the wire-pull test location for testing a strength of a connection of the wire to at least one of the first terminating location or the second terminating location. An adjustment is performed such that a visual guide is oriented on the wire at the wire-pull test location.

Abstract: A mechanism is provided for identifying a wire-pull test location on a wire of a microelectronic package. A first distance between a first terminating location of the wire on the microelectronic package and a second terminating location of the wire on the microelectronic package is determined. Based on the first distance, a second distance from either the first terminating location or the second terminating location is determined as the wire-pull test location for testing a strength of a connection of the wire to at least one of the first terminating location or the second terminating location. An adjustment is performed such that a visual guide is oriented on the wire at the wire-pull test location.

Abstract: In one embodiment, an instruction from an auditor to capture an image of an object is received. The image of the object is captured. The captured image of the object is transmitted in real-time to the auditor for viewing and/or verification that the captured image satisfies the instruction. The instruction and/or the object are associated with an audit.

Abstract: In one embodiment, an instruction from an auditor to capture an image of an object is received. The image of the object is captured. The captured image of the object is transmitted in real-time to the auditor for viewing and/or verification that the captured image satisfies the instruction. The instruction and/or the object are associated with an audit.

Abstract: A mechanism is provided for identifying a wire-pull test location on a wire of a microelectronic package. A first distance between a first terminating location of the wire on the microelectronic package and a second terminating location of the wire on the microelectronic package is determined. Based on the first distance, a second distance from either the first terminating location or the second terminating location is determined as the wire-pull test location for testing a strength of a connection of the wire to at least one of the first terminating location or the second terminating location. An adjustment is performed such that a visual guide is oriented on the wire at the wire-pull test location.