Patents by Inventor Mark Tehmin Yin

Mark Tehmin Yin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Modular chassis with fabric integrated into the line card
    Patent number: 11029749
    Abstract: In one embodiment, a system includes a number of application-specific integrated circuits (ASICs). At least one of the ASICs is configured to process incoming data packets and outgoing data packets. At least one of the ASICs is configured to move data between a respective networking module and a destination networking module. The system also includes a cable backplane having a number of parallel cables configured to transmit data between the number of ASICs.
    Type: Grant
    Filed: March 31, 2017
    Date of Patent: June 8, 2021
    Assignee: Platina Systems Corp.
    Inventors: Frank Szu-Jen Yang, Jason Luo Pang, Mark Tehmin Yin
  • Heterogeneous network in a modular chassis
    Patent number: 10416752
    Abstract: In one embodiment, a system includes a number of application-specific integrated circuits (ASICs). The system also includes one or more processors coupled to the ASICs including instructions executable by the processors. The processors being operable when executing the instructions to configure the plurality of ASICs to route data packets using a standard protocol; configure the ASICs to set up a tunnel, using the standard protocol, for moving data packets from one ASIC to another of the number of ASICs; and implement a software overlay to facilitate interaction between the number of ASICs through the tunnel for moving the data packets.
    Type: Grant
    Filed: October 22, 2018
    Date of Patent: September 17, 2019
    Assignee: Platina Systems Corporation
    Inventors: Frank Szu-Jen Yang, Jason Luo Pang, Eliot Michael Dresselhaus, Dino Farinacci, Andreas Demetrios Bovopoulos, Mark Tehmin Yin
  • Heterogeneous Network in a Modular Chassis
    Publication number: 20190056776
    Abstract: In one embodiment, a system includes a number of application-specific integrated circuits (ASICs). The system also includes one or more processors coupled to the ASICs including instructions executable by the processors. The processors being operable when executing the instructions to configure the plurality of ASICs to route data packets using a standard protocol; configure the ASICs to set up a tunnel, using the standard protocol, for moving data packets from one ASIC to another of the number of ASICs; and implement a software overlay to facilitate interaction between the number of ASICs through the tunnel for moving the data packets.
    Type: Application
    Filed: October 22, 2018
    Publication date: February 21, 2019
    Inventors: Frank Szu-Jen Yang, Jason Luo Pang, Eliot Michael Dresselhaus, Dino Farinacci, Andreas Demetrios Bovopoulos, Mark Tehmin Yin
  • Heterogeneous network in a modular chassis
    Patent number: 10139894
    Abstract: In one embodiment, a system includes a number of application-specific integrated circuits (ASICs). The system also includes one or more processors coupled to the ASICs including instructions executable by the processors. The processors being operable when executing the instructions to configure the plurality of ASICs to route data packets using a standard protocol; configure the ASICs to set up a tunnel, using the standard protocol, for moving data packets from one ASIC to another of the number of ASICs; and implement a software overlay to facilitate interaction between the number of ASICs through the tunnel for moving the data packets.
    Type: Grant
    Filed: March 31, 2017
    Date of Patent: November 27, 2018
    Assignee: Platina Systems Corp.
    Inventors: Frank Szu-Jen Yang, Jason Luo Pang, Eliot Michael Dresselhaus, Dino Farinacci, Andreas Demetrios Bovopoulos, Mark Tehmin Yin
  • Heterogeneous Network in a Modular Chassis
    Publication number: 20170289029
    Abstract: In one embodiment, a system includes a number of application-specific integrated circuits (ASICs). The system also includes one or more processors coupled to the ASICs including instructions executable by the processors. The processors being operable when executing the instructions to configure the plurality of ASICs to route data packets using a standard protocol; configure the ASICs to set up a tunnel, using the standard protocol, for moving data packets from one ASIC to another of the number of ASICs; and implement a software overlay to facilitate interaction between the number of ASICs through the tunnel for moving the data packets.
    Type: Application
    Filed: March 31, 2017
    Publication date: October 5, 2017
    Inventors: Frank Szu-Jen Yang, Jason Luo Pang, Thomas M. Grennan, Eliot Michael Dresselhaus, Dino Farinacci, Andreas Demetrios Bovopoulos, Mark Tehmin Yin
  • Modular Chassis with Fabric Integrated into the Line Card
    Publication number: 20170286339
    Abstract: In one embodiment, a system includes a number of application-specific integrated circuits (ASICs). At least one of the ASICs is configured to process incoming data packets and outgoing data packets. At least one of the ASICs is configured to move data between a respective networking module and a destination networking module. The system also includes a cable backplane having a number of parallel cables configured to transmit data between the number of ASICs.
    Type: Application
    Filed: March 31, 2017
    Publication date: October 5, 2017
    Inventors: Frank Szu-Jen Yang, Jason Luo Pang, Mark Tehmin Yin