Abstract: A method and associated pallet assembly for reflow soldering electrical interconnections between a pair of printed circuits, at least one of which features a relatively-low-softening-temperature substrate, includes fixturing the printed circuits between the mating surfaces of a pallet and a cover, wherein the cover includes a first aperture adapted to expose an area on the back face of the first printed circuit. When the palletized printed circuits are advanced through a reflow oven, a nozzle directs hot gases through the first aperture to impinge directly upon the back face of the substrate to thereby reflow a solder layer sandwiched between the respective substrates of the printed circuits. Additional components on the second printed circuit are advantageously soldered in the same pass as hot gases from the nozzle flow through a second aperture defined in the pallet assembly's cover to impinge upon an additional solder layer on the second printed circuit.

Abstract: The present invention involves a composite pallet for a substrate of a printed circuit board for a vector transient reflow process. The composite pallet includes a heat conductive layer for heat sinking means from the substrate and a heat insulative layer adjacent the conductive layer to shield the substrate from heat and to absorb heat from the heat conductive layer. The heat conductive layer has first and second opposite surfaces. The first surface is configured to receive the substrate disposed thereon to diffuse heat from the substrate during the vector transient reflow process. The heat insulative layer is disposed adjacent the second surface.