Abstract: A method, apparatus, article of manufacture, and system, the method including, in some embodiments, processing a computational load by a first core of a multi-core processor, and dynamically distributing at least a portion of the computational load to a second core of the multi-core processor to reduce a power density of the multi-core processor for the processing of the computational load.

Abstract: A device to efficiently boil and distribute liquid vapor by using a high efficiency heat exchanger technology that incorporates the high heat spreading capability of two-phase heat transfer physics. The evaporation/boiling permits the heat load from a discrete component to be efficiently spread via vapor transport to the entire HEX fin array. In doing so, both the spreading resistance and air-side convective resistance may be made superior to air-cooled technologies alone and rival liquid cooling performance, but without moving parts or need of a mechanical pump. One embodiment is the combination of highly effective vapor distribution and liquid condensate return channels, a high surface area air-side heat exchanger that serves as the vapor condenser, and an efficient evaporation chamber to form a complete thermal solution.

Abstract: A novel cold plate may include one or more of the following features: relatively narrow channel gaps, two or more flow paths, primarily non-linear flow paths, and/or tapered channel walls.

Abstract: A method, apparatus, article of manufacture, and system, the method including, in some embodiments, processing a computational load by a first core of a multi-core processor, and dynamically distributing at least a portion of the computational load to a second core of the multi-core processor to reduce a power density of the multi-core processor for the processing of the computational load.

Abstract: Some aspects provide a chamber to hold a fluid, the chamber including an evaporation surface and a condensation wall having a condensation surface, and a heat dissipator coupled to the condensation wall. The evaporation surface is to evaporate the fluid and the condensation surface is to condense the evaporated fluid in a case that the apparatus is in a first orientation and in a case that the apparatus is in a second orientation that is rotated substantially ninety degrees from the first orientation around an axis that does not intersect the evaporation surface. In some aspects, the evaporation surface comprises structures to facilitate boiling nucleation.

Abstract: Embodiments of a method of fabricating a substrate including thermally conductive structures, as well as devices made from such a substrate, are disclosed. Each thermally conductive structure includes a via and a number of carbon nanotubes formed within the via. An active circuit element disposed on the substrate may at least partially overlie (or underlie) a location of one of the vias. The substrate may be cut into a number of separate die, each die including some of the thermally conductive structures. Other embodiments are described and claimed.

Abstract: A cooling apparatus is provided with an electrostatic flow modifier to be complementarily positioned relative to a cooling fluid flow to modify at least one characteristic of the cooling fluid flow to enhance an amount of heat the cooling fluid flow removes from an electronic component.

Abstract: A cooling apparatus is provided with an electrostatic flow modifier to be complementarily positioned relative to a cooling fluid flow to modify at least one characteristic of the cooling fluid flow to enhance an amount of heat the cooling fluid flow removes from an electronic component.

Abstract: A method and apparatus for cooling an integrated circuit die. An integrated circuit package comprises an integrated circuit die. A cooling fluid makes contact with the integrated circuit die. In one embodiment, an interposer is disposed between the integrated circuit die and a package substrate. The integrated circuit die and/or the interposer may have microchannels in its surface.

Abstract: A thermal management device includes a thermally conductive core, a thermally conductive frame positioned around the core, the frame defining at least one opening, and at least one thermally conductive insert disposed in the opening in the frame.

Abstract: A novel cold plate may include one or more of the following features: relatively narrow channel gaps, two or more flow paths, primarily non-linear flow paths, and/or tapered channel walls.

Abstract: A thermal management device includes a thermally conductive core, a thermally conductive frame positioned around the core, the frame defining at least one opening, and at least one thermally conductive insert disposed in the opening in the frame.

Abstract: According to some embodiments, a cooling system that may be installed in a computer chassis has a fluid-containing space that is sealed and pressurized by an inert gas. The fluid-containing space may be formed from a cold plate that may serve as a heat sink for an integrated circuit, a heat exchanger, tubing, and a pump volume. A coolant may be contained in the fluid-containing space.

Abstract: According to some embodiments, a cooling system that may be installed in a computer chassis has a fluid-containing space that is sealed and pressurized by an inert gas. The fluid-containing space may be formed from a cold plate that may serve as a heat sink for an integrated circuit, a heat exchanger, tubing, and a pump volume. A coolant may be contained in the fluid-containing space.

Abstract: Cilia-like micro surface actuators are applied to fins of a heat sink to improve heat dissipation. The surface actuators act as active surface features whose motion disrupts the boundary layer fluid flow by entraining cool fluid towards the heat transfer surfaces of the fins and ejecting relatively warmer fluid away from the surfaces. This disruption reduces the thermal resistance between the heat sink fins and the fluid (e.g., the convection resistance). The motion of the surface actuators also induces a net flow along the surface of the fin(s) and can, therefore, be viewed analogously to a “pump” moving fluid (such as air) over the surface. The surface actuators can be fabricated using plastic microelectromechanical systems (MEMS) technology and can be actuated to generate their motion using several techniques.

Abstract: A method and apparatus for cooling an integrated circuit die. An integrated circuit package comprises an integrated circuit die. A cooling fluid makes contact with the integrated circuit die. In one embodiment, an interposer is disposed between the integrated circuit die and a package substrate. The integrated circuit die and/or the interposer may have microchannels in its surface.

Abstract: Cilia-like micro surface actuators are applied to fins of a heat sink to improve heat dissipation. The surface actuators act as active surface features whose motion disrupts the boundary layer fluid flow by entraining cool fluid towards the heat transfer surfaces of the fins and ejecting relatively warmer fluid away from the surfaces. This disruption reduces the thermal resistance between the heat sink fins and the fluid (e.g., the convection resistance). The motion of the surface actuators also induces a net flow along the surface of the fin(s) and can, therefore, be viewed analogously to a “pump” moving fluid (such as air) over the surface. The surface actuators can be fabricated using plastic microelectromechanical systems (MEMS) technology and can be actuated to generate their motion using several techniques.

Abstract: The present invention involves a system for altering the aerodynamic shape and/or fluid flow field about a solid body. The preferred embodiment comprises a synthetic jet actuator embedded in a solid body, with the jet orifice built into the body surface. The synthetic jet actuator generates a series of fluid vortices emanating from the orifice so as to entrain fluid external to the actuator chamber and form a synthetic jet stream. A recirculating flow region is formed along the solid body surface about the synthetic jet orifice. As a result the apparent aerodynamic shape of the body is altered. Consequently, if the solid body is placed in a fluid flow field, the entire fluid flow field is altered by the operation of the synthetic jet actuator.

Abstract: A synthetic jet actuator, which can be micromachined if desired, generates a synthetic jet stream characterized by a series of successive vortices that can be used for effectively entraining adjacent fluid. The synthetic jet actuator can be used to bend, or vector, a jet stream from another jet actuator. Further, because the synthetic jet actuator exhibits zero net mass flux, the synthetic jet actuator can be used within a bounded volume. In structure, the synthetic jet actuator comprises a housing defining an internal chamber and having an orifice. A flexible metallized diaphragm forms a wall of the housing and can change the volume of the chamber when moved. An electrode is disposed adjacent to and spaced from the diaphragm, and an electrical bias is imposed between the metallized diaphragm and the electrode by a control system to force movement of the diaphragm. As the diaphragm moves, the volume in the internal chamber changes and vortices are ejected from the chamber through the orifice.

Abstract: Synthetic jet actuator, which can be micromachined if desired, generates a synthetic jet stream characterized by a series of successive vortices that can be used for effectively entraining adjacent fluid. The synthetic jet actuator can be used to bend, or vector, a jet stream from another jet actuator. Further, because the synthetic jet actuator exhibits zero net mass flux, the synthetic jet actuator can be used within a bounded volume. In structure, the synthetic jet actuator comprises a housing defining an internal chamber and having an orifice. A flexible metallized diaphragm forms a wall of the housing and can change the volume of the chamber when moved. An electrode is disposed adjacent to and spaced from the diaphragm, and an electrical bias is imposed between the metallized diaphragm and the electrode by a control system to force movement of the diaphragm. As the diaphragm moves, the volume in the internal chamber changes and vortices are ejected from the chamber through the orifice.