Abstract: Disclosed is an interposer for accessing one or more signals from an Integrated Circuit (IC) package. The interposer is disposed between the IC package and a socket body. The interposer comprises a plurality of clearance holes and at least one connecting element. The plurality of clearance holes allows an array of contacts on a first surface of the socket body to pass through the interposer and make electrical contact with a first set of contacts of a plurality of contacts of the IC package. The at least one connecting element is configured to make electrical contact with a second set of contacts of the plurality of contacts of the IC package. The electrical contact between the at least one connecting element and the second set of contacts of the plurality of contacts of the IC package provides access to the one or more signals from the IC package.

Abstract: Disclosed is an interposer for accessing one or more signals from an Integrated Circuit (IC) package. The interposer is disposed between the IC package and a socket body. The interposer comprises a plurality of clearance holes and at least one connecting element. The plurality of clearance holes allows an array of contacts on a first surface of the socket body to pass through the interposer and make electrical contact with a first set of contacts of a plurality of contacts of the IC package. The at least one connecting element is configured to make electrical contact with a second set of contacts of the plurality of contacts of the IC package. The electrical contact between the at least one connecting element and the second set of contacts of the plurality of contacts of the IC package provides access to the one or more signals from the IC package.

Abstract: An apparatus includes a printed circuit board (PCB) and a first flexible conductive cable (“flex cable”) secured to the PCB. The apparatus also includes a daughter card having an end adjacent to the PCB and a second flex cable secured to the daughter card. The apparatus further includes a connector which provides an electrically conductive connection between the first flex cable and the second flex cable. The connector is positioned to sandwich a portion of the first flex cable between the connector and the PCB.

Abstract: In some embodiments, a socket with integral, retractable socket contact protector is presented. In this regard, a contact protector is introduced to protect contacts, and to provide openings through which the contacts can emerge to couple with lands. Other embodiments are also disclosed and claimed.

Abstract: An apparatus includes a printed circuit board (PCB) and a first flexible conductive cable (“flex cable”) secured to the PCB. The apparatus also includes a daughtercard having an end adjacent to the PCB and a second flex cable secured to the daughter card. The apparatus further includes a connector which provides an electrically conductive connection between the first flex cable and the second flex cable. The connector is positioned to sandwich a portion of the first flex cable between the connector and the PCB.

Abstract: In some embodiments, a socket with integral, retractable socket contact protector is presented. In this regard, a contact protector is introduced to protect contacts, and to provide openings through which the contacts can emerge to couple with lands. Other embodiments are also disclosed and claimed.

Abstract: A coupler is passively aligned over a substrate, wherein the coupler is laterally aligned to an optoelectronic (OE) device coupled to the substrate. The coupler is placed on the substrate, wherein the coupler is vertically aligned to the OE device. The coupler is fixed to the substrate.

Abstract: In some embodiments, a socket with integral, retractable socket contact protector is presented. In this regard, a contact protector is introduced to protect contacts, and to provide openings through which the contacts can emerge to couple with lands. Other embodiments are also disclosed and claimed.

Abstract: Circuit board and system with multi-portion sockets, and signal methods practiced thereon are described herein.

Abstract: A multi-portion socket, related components, and systems having such socket/components are described herein.

Abstract: An assembly including a processor socket having a cut region. The assemble further including a probe board having a repeater positioned in alignment with the cut region. The repeater is to receive at least a first signal. The repeater is to tap the first signal. The tapped first signal is to be transmitted to a first device. The repeater is also to reinject the first signal, and the reinjected first signal to be transmitted to a processor.

Abstract: An apparatus and method for reliably interconnecting a test device with a circuit board designed for fine pitch solder lead surface mounted components is described. The test equipment interface system of the present invention comprises a board interconnect unit, an interposer, and a test device cable. The test device cable is coupled to a test device, which can receive and manipulate signals via the cable. These signals correspond to signals provided by a component being emulated by the present invention. A component being emulated is replaced on the circuit board by the board interconnect unit. The board interconnect unit has leads or pins in a quantity, size, and configuration corresponding to a component being emulated and is typically soldered to a circuit board under test for the purpose of analyzing and debugging the circuitry on the circuit board. The board interconnect unit comprises a lead frame which is attached to a metal body.

Abstract: An apparatus and method for reliably interconnecting a test device with a circuit board designed for fine pitch solder lead surface mounted components is described. The test equipment interface system of the present invention includes a board interconnect unit, an interposer, and a test device cable. The test device cable is coupled to a test device, which can receive and manipulate signals via the cable. These signals correspond to signals provided by a component being emulated by the present invention. A component being emulated is replaced on the circuit board by the board interconnect unit. The board interconnect unit has leads or pins in a quantity, size, and configuration corresponding to a component being emulated and is typically soldered to a circuit board under test for the purpose of analyzing and debugging the circuitry on the circuit board. The board interconnect unit features a lead frame which is attached to a metal body.