Patents by Inventor Mark Vininski

Mark Vininski has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SYSTEM FOR MAKING A CONDUCTIVE CIRCUIT ON A SUBSTANTIALLY NON-CONDUCTIVE SUBSTRATE
    Publication number: 20070094873
    Abstract: A method for forming a conductive circuit on a substantially non-conductive substrate includes indenting a major surface of a substrate with a plurality of features, plating the major surface and the indentations formed with a conductive layer, and removing a portion of the conductive layer leaving at least one of the plurality of the indentations filled with conductive material separated from at least one other of the plurality of the indentations filled with conductive material separated by non-conductive material. An electrical device formed includes a sheet of insulative material having grooves therein. The sheet of insulative material has a first planar surface, and a second planar surface. A conductive material is positioned within the grooves. The conductive material within the grooves forms electrical traces in the electrical device. The conductive material within the grooves fills the groove and includes a surface coplanar with at least one of the first planar surface or the second planar surface.
    Type: Application
    Filed: December 5, 2006
    Publication date: May 3, 2007
    Inventors: David McConville, Mark Vininski
  • System for making a conductive circuit on a substantially non-conductive substrate
    Patent number: 7155819
    Abstract: A method for forming a conductive circuit on a substantially non-conductive substrate includes indenting a major surface of a substrate with a plurality of features, plating the major surface and the indentations formed with a conductive layer, and removing a portion of the conductive layer leaving at least one of the plurality of the indentations filled with conductive material separated from at least one other of the plurality of the indentations filled with conductive material separated by non-conductive material. An electrical device formed includes a sheet of insulative material having grooves therein. The sheet of insulative material has a first planar surface, and a second planar surface. A conductive material is positioned within the grooves. The conductive material within the grooves forms electrical traces in the electrical device. The conductive material within the grooves fills the groove and includes a surface coplanar with at least one of the first planar surface or the second planar surface.
    Type: Grant
    Filed: June 30, 2003
    Date of Patent: January 2, 2007
    Assignee: Intel Corporation
    Inventors: David P McConville, Mark Vininski
  • Method and apparatus for forming printed circuit boards using imprinting and grinding
    Publication number: 20040262029
    Abstract: A method for forming a conductive circuit on a substantially non-conductive substrate includes indenting a major surface of a substrate with a plurality of features, plating the major surface and the indentations formed with a conductive layer, and removing a portion of the conductive layer leaving at least one of the plurality of the indentations filled with conductive material separated from at least one other of the plurality of the indentations filled with conductive material separated by non-conductive material. An electrical device formed includes a sheet of insulative material having grooves therein. The sheet of insulative material has a first planar surface, and a second planar surface. A conductive material is positioned within the grooves. The conductive material within the grooves forms electrical traces in the electrical device. The conductive material within the grooves fills the groove and includes a surface coplanar with at least one of the first planar surface or the second planar surface.
    Type: Application
    Filed: June 30, 2003
    Publication date: December 30, 2004
    Inventors: David P. McConville, Mark Vininski