Abstract: A packaged integrated circuit is presented for placement on a printed circuit board (PCB) layer providing power lines and data access channels. The packaged integrated circuit includes; a package substrate having data channels and power lines; a circuit substrate having functional components, wherein (a) the power lines and the data channels in the package substrate are coupled to the functional components of the substrate by conducting bumps, (b) the conducting balls coupling the data access channels in the PCB to the data channels in the package substrate are located along the edges of the package substrate; and (c) the conducting balls coupling the power lines in the PCB and the power lines in the package substrate are located in an interior portion of the package substrate. Also, an integrated circuit may further include a circuit substrate having active components, including a SerDes circuit at a center portion of the substrate.

Abstract: A chip layout for a high speed semiconductor device is disclosed. The chip layout isolates Rx terminals and Rx ports from Tx terminals and Tx ports. A serial interface is centrally located to reduce latency, power and propagation delays. Stacked die that contain one or more devices with the chip layout are characterized by having improved latency, bandwidth, power consumption, and propagation delays.

Abstract: A memory system including a memory array, an input circuit and a logic circuit is presented. The input circuit is coupled to receive a memory address and a set of individual write controls for each byte of data word. During a write operation, the input circuit also receives the corresponding write data to be written into the SRAM. The logic circuit causes the write data and write control information to be stored in the input circuit for the duration of any sequential read operations immediately following the write operation and then to be read into memory during a subsequent write operation. During the read operation, data which is stored in the write data storage registers prior to being read into the memory can be read out from the memory system should the address of one or more read operations equal the address of the data to be written into the memory while temporarily stored in the write data storage registers.

Abstract: A quad data rate RAM (100) in accordance with the invention is a burst synchronous RAM with separate data buses (Data-In, Data-Out) for read and write data. Data can be transferred on both buses and on both the rising and the falling edge of the clock (CLK). Operating at the maximum throughput, four data items are transferred per clock cycle. In one embodiment, data is written to or read from the RAM in bursts of four data items. The RAM includes four independent internal RAM blocks (44-47). in a write burst, (i) a write address, (ii) control signal(s), and (iii) four write data items are sequentially presented to the respective four internal RAM blocks at the respective four clock edges of two consecutive clock cycles. A read burst is carried out similar to a write burst except that there is a one clock cycle latency between the four read data items and the burst address.

Abstract: A memory system including a memory array, an input circuit and a logic circuit is presented. The input circuit is coupled to receive a memory address and a set of individual write controls for each byte of data word. During a write operation, the input circuit also receives the corresponding write data to be written into the SRAM. The logic circuit causes the write data and write control information to be stored in the input circuit for the duration of any sequential read operations immediately following the write operation and then to be read into memory during a subsequent write operation. During the read operation, data which is stored in the write data storage registers prior to being read into the memory can be read out from the memory system should the address of one or more read operations equal the address of the data to be written into the memory while temporarily stored in the write data storage registers.

Abstract: A memory system including a memory array, an input circuit and a logic circuit is presented. The input circuit is coupled to receive a memory address and a set of individual write controls for each byte of data word. During a write operation, the input circuit also receives the corresponding write data to be written into the SRAM. The logic circuit causes the write data and write control information to be stored in the input circuit for the duration of any sequential read operations immediately following the write operation and then to be read into memory during a subsequent write operation. During the read operation, data which is stored in the write data storage registers prior to being read into the memory can be read out from the memory system should the address of one or more read operations equal the address of the data to be written into the memory while temporarily stored in the write data storage registers.