Abstract: The invention comprises an improved end effector for a robot which is particularly advantageous in applications such as placing flat pack integrated circuits on circuit boards. The end effector includes a vacuum-operated quill for picking up the integrated circuit from a predetermined location. A pressure spring mechanism is included in the end effector permits the flat pack to be held in the desired position with a predetermined force by utilizing the robot arm to compress the pressure spring a predetermined amount. Once the integrated circuit is positioned on the circuit board, the circuit is released and the quill moved away from the board a predetermined distance by a linear actuator included in the end effector without any motion of the robotic arm.