Abstract: A microwave frequency signal path crossover apparatus for surface mounting to a circuit board. The signal path crossover including interspaced planar horizontal shielding members, horizontal dielectric members, and vertical shielding vias surrounding horizontal signal carrying members connected to the circuit board by vertical vias. Low errant signal emitting structures including partial half and three quarter arc vias, terminating arms, half circle arc transition apertures, via grounding fingers, and compensating capacitive structures are taught.

Abstract: The present invention is a mobile hotspot system comprising a first bi-directional antenna operably coupled to a transceiver capable of at least demodulation, modulation, and amplification and a second omni-directional antenna operably coupled to said transceiver; an electrical power source operably coupled to said transceiver. RF interconnections between said transceiver, said first bi-directional antenna, said transceiver and said second-directional antenna are also provided. The system is housed in a compact, weather-resistant radome, and optionally includes a power source, which may be one or more of batteries, battery chargers, and power connections.

Abstract: An antenna is disclosed. The antenna may have a slotted conductive reference sheet, a first dielectric material and a second dielectric material. The first dielectric material may reside on a first side of the reference sheet, and the second dielectric material may reside on the second side of the reference sheet. The first dielectric material has a first K-value, and the second dielectric material has a second K-value. The second K-value is larger than the first K-value.

Abstract: A directional coupler having (a) a first coupled microstrip section having a first terminus (T1) and a second terminus (T2), (b) a second coupled microstrip section having a first terminus at T2 and a second terminus (T3), and (c) a first phase-velocity-compensating capacitor connected across the conductors of the microstrip sections at T2 is disclosed. The coupler also may include a second phase-velocity-compensating capacitor connected at T1, and a third phase-velocity compensating capacitor connected across the conductors at T3.

Abstract: A directional coupler having (a) a first coupled microstrip section having a first terminus (T1) and a second terminus (T2), (b) a second coupled microstrip section having a first terminus at T2 and a second terminus (T3), and (c) a first phase-velocity-compensating capacitor connected across the conductors of the microstrip sections at T2 is disclosed. The coupler also may include a second phase-velocity-compensating capacitor connected at T1, and a third phase-velocity compensating capacitor connected across the conductors at T3.

Abstract: An antenna is disclosed. The antenna may have a slotted conductive reference sheet, a first dielectric material and a second dielectric material. The first dielectric material may reside on a first side of the reference sheet, and the second dielectric material may reside on the second side of the reference sheet. The first dielectric material has a first K-value, and the second dielectric material has a second K-value. The second K-value is larger than the first K-value.

Abstract: A standing axial-leaded surface mount capacitor is formed of a dielectric chip capacitor sandwiched between first and second blocks. The end blocks have profiles to match the profile of said chip capacitor. The end blocks are conductive at least on their outer surfaces and serve as leads to attaching to metallic surface traces of a printed circuit. In one preferred embodiment, the end blocks are ceramic cubes with metallic surfaces on its faces. The metallized cubes give the device rotational symmetry about its long axis, so that the capacitor will have identical performance in any orientation. This feature makes it possible to automatically pick and place the device onto a circuit board. Preferably, the dielectric chip has a square profile of the same dimension as the ceramic cubes. The profile of the cubes and the chip can be 20 to 25 mils to match the width of a typical printed circuit trace. The capacitors can be of any typical value, i.e., between 0.05 and 300 pf.