Patents by Inventor Mark W. Kapfhammer

Mark W. Kapfhammer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7168609
    Abstract: A method and structure is disclosed for detaching a chip from a substrate that delays the delivery of shear force to the chip until the connectors attaching the chip to the substrate are soft enough that the delivery of shear force will not damage the chip's connectors. More particularly, the shear force is created by a bimetallic disk that, when heat is applied, is transformed into shearing force. The shearing force is delayed by a delaying device until the connectors connecting the chip to the substrate are soft enough that the application of shear force will separate the chip from the substrate without damaging the chip's connectors. The delaying device includes a physical gap that may be adjusted to control when the shear force is applied to the chip.
    Type: Grant
    Filed: September 3, 2002
    Date of Patent: January 30, 2007
    Assignee: International Business Machines Corporation
    Inventors: Lannie R Bolde, James H Covell, Mark W. Kapfhammer
  • Publication number: 20040041011
    Abstract: A method and structure is disclosed for detaching a chip from a substrate that delays the delivery of shear force to the chip until the connectors attaching the chip to the substrate are soft enough that the delivery of shear force will not damage the chip's connectors. More particularly, the shear force is created by a bimetallic disk that, when heat is applied, is transformed into shearing force. The shearing force is delayed by a delaying device until the connectors connecting the chip to the substrate are soft enough that the application of shear force will separate the chip from the substrate without damaging the chip's connectors. The delaying device includes a physical gap that may be adjusted to control when the shear force is applied to the chip.
    Type: Application
    Filed: September 3, 2002
    Publication date: March 4, 2004
    Applicant: International Business Machines Corporation
    Inventors: Lannie R. Bolde, James H. Covell, Mark W. Kapfhammer
  • Patent number: 5929865
    Abstract: A method for sorting two-dimensional graphics data into raster lines is described. The method decomposes the graphic images into vector line and arc segments with their associated two-dimensional coordinates. A vector or sub-shape list is then established containing the coordinates of all the vector lines and arcs. Sorting is then performed on the vector data by organizing each vector based upon its X- or Y- coordinate information. Pixels that make up each sub-shape are then computed. This computation is performed for each sub-shape in the order given by the sorted, sub-shape list. The resultant pixel list is ordered according to the X- or Y- dimensional sort previously performed. Pixels generated in a partially pre-sorted arrangement are arranged in a pixel array. The stored pixel array is then used to form raster lines.
    Type: Grant
    Filed: June 14, 1996
    Date of Patent: July 27, 1999
    Assignee: International Business Machines Corporation
    Inventors: James G. Balz, Mark W. Kapfhammer, Mark J. LaPlante, David C. Long
  • Patent number: 5522963
    Abstract: Method for thermally-machining large area features, and screen-depositing metallurgy on a ceramic dielectric greensheet. The method comprises an improvement over the conventional integrated disposable mask process, and involves the steps of outlining the large feature areas through a masking film laminated to a greensheet, using a high intensity energy beam such as a laser beam, electron beam, photon beam, etc, forming a stencil sheet having corresponding large area feature openings, and laminating the stencil sheet in registration over the masking film. An adhesive sheet is pressed against the back of the stencil sheet, through the stencil openings, to adhere to the outline features on the masking film and to remove them when the stencil sheet is separated from the masking film. Conductive paste is applied to the greensheet, through the large feature openings in the masking film, and the electroded greensheet is fired for use in preparing multi-layer ceramic packages.
    Type: Grant
    Filed: May 31, 1994
    Date of Patent: June 4, 1996
    Assignee: International Business Machines Corporation
    Inventors: Robert H. Anders, Jr., William Cobbett, Jr., William T. Grant, Mark W. Kapfhammer, Nabil A. Rizk, Nirmal S. Sandhu, Mohamad A. Sarfaraz, You-Wen Yau