Patents by Inventor Mark W. Sewell

Mark W. Sewell has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6766746
    Abstract: A mission responsive ordnance includes projectiles arranged in a bundled configuration that defines a substantially solid structure with each of the projectiles forming a geometric portion thereof. In a unitary mode of operation, the bundled configuration is maintained to define an integral structural element that bears loads generated when the bundled configuration strikes and penetrates a target. In a sub-divided mode of operation, the projectiles are un-bundled before a target is struck so that the projectiles are released into a surrounding environment.
    Type: Grant
    Filed: September 5, 2003
    Date of Patent: July 27, 2004
    Assignee: The United States of America as represented by the Secretary of the Navy
    Inventors: Timothy L. Spivak, Mark W. Sewell, Perry L. Fridley, Jr., Michael M. Canaday
  • Publication number: 20040055499
    Abstract: A mission responsive ordnance includes projectiles arranged in a bundled configuration that defines a substantially solid structure with each of the projectiles forming a geometric portion thereof. In a unitary mode of operation, the bundled configuration is maintained to define an integral structural element that bears loads generated when the bundled configuration strikes and penetrates a target. In a sub-divided mode of operation, the projectiles are un-bundled before a target is struck so that the projectiles are released into a surrounding environment.
    Type: Application
    Filed: September 5, 2003
    Publication date: March 25, 2004
    Inventors: Timothy L. Spivak, Mark W. Sewell, Perry L. Fridley, Michael M. Canaday
  • Patent number: 6640723
    Abstract: A mission responsive ordnance of the present invention arranges a plurality of projectiles in a bundled configuration. The bundled configuration is defined by the projectiles and a bundling means which, together, form a combination that bears loads generated when the bundled configuration strikes and penetrates a target. Unbundling means, coupled to the bundling means, can be operated to selectively render the bundling means inoperative before the target is struck so that one or more of the projectiles are released from their bundled configuration.
    Type: Grant
    Filed: March 25, 2002
    Date of Patent: November 4, 2003
    Assignee: The United States of America as represented by the Secretary of the Navy
    Inventors: Timothy Spivak, Mark W. Sewell, Perry L. Fridley, Jr., Michael M. Canaday
  • Publication number: 20030177934
    Abstract: A mission responsive ordnance of the present invention arranges a plurality of projectiles in a bundled configuration. The bundled configuration is defined by the projectiles and a bundling means which, together, form a combination that bears loads generated when the bundled configuration strikes and penetrates a target. Unbundling means, coupled to the bundling means, can be operated to selectively render the bundling means inoperative before the target is struck so that one or more of the projectiles are released from their bundled configuration.
    Type: Application
    Filed: March 25, 2002
    Publication date: September 25, 2003
    Inventors: Timothy L. Spivak, Mark W. Sewell, Perry L. Fridley, Michael M. Canaday
  • Patent number: 5218517
    Abstract: A device for dissipating heat from cased electronics where optimum heat tsfer is required, and where easy removability is desired. The device finds utility in sonobuoys, buoys, missiles and mines, as well as cabling electronics such as transoceanic communications equipment. The device contains a translating wedge which is drawn into a forced fit between the heat generating module and a conducting wedge which contacts the electronics case, resulting in a high efficiency conducting thermal path from the electronics to the equipment case. The device is particularly efficate in circular cased electronics.
    Type: Grant
    Filed: May 18, 1992
    Date of Patent: June 8, 1993
    Assignee: The United States of America as represented by the Secretary of the Navy
    Inventor: Mark W. Sewell
  • Patent number: 5060115
    Abstract: A device for dissipating heat from electronics encased in a circular hous is disclosed for uses in buoys, sonobuoys, mines and missiles. The device contains a heat dissipating ring that engages the inner surface of the cylindrical electronics case. The inside surface of this ring is tapered to receive a heat transfer disk that is pulled into tight union with the heat dissipating ring. A heat generating module is mounted in heat transfer union with the disk whereby excess heat is transferred from the disk through the ring to the electronics case where it is dissipated into the environment.
    Type: Grant
    Filed: September 28, 1990
    Date of Patent: October 22, 1991
    Assignee: The United States of America as represented by the Secretary of the Navy
    Inventor: Mark W. Sewell