Patents by Inventor Mark W. Vander Pol

Mark W. Vander Pol has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electrical device having boardless electrical component mounting arrangement
    Patent number: 8764240
    Abstract: An electrical device such as an LED light assembly includes a conductive circuit and one or more electrical components connected to the circuit. The electrical components and the circuit are at least partially overmolded with a thermoplastic polymer material to encapsulate the components. The material utilized to cover the circuit and/or electrical components may also be utilized to form a housing or other structure of a finished part.
    Type: Grant
    Filed: March 2, 2011
    Date of Patent: July 1, 2014
    Assignee: Innotec Corp.
    Inventors: Thomas J. Veenstra, Paul T. Vander Kuyl, Matthew S. Weeda, Michael L. Lanser, Kyle A. Israels, Jason R. Mulder, Mark W. Vander Pol
  • ELECTRICAL DEVICE HAVING BOARDLESS ELECTRICAL COMPONENT MOUNTING ARRANGEMENT
    Publication number: 20110146068
    Abstract: An electrical device such as an LED light assembly includes a conductive circuit and one or more electrical components connected to the circuit. The electrical components and the circuit are at least partially overmolded with a thermoplastic polymer material to encapsulate the components. The material utilized to cover the circuit and/or electrical components may also be utilized to form a housing or other structure of a finished part.
    Type: Application
    Filed: March 2, 2011
    Publication date: June 23, 2011
    Applicant: INNOTEC, CORP.
    Inventors: Thomas J. Veenstra, Paul T. Vander Kuyl, Matthew S. Weeda, Michael L. Lanser, Kyle A. Israels, Jason R. Mulder, Mark W. Vander Pol
  • Electrical device having boardless electrical component mounting arrangement
    Patent number: 7909482
    Abstract: An electrical device such as an LED light assembly includes a conductive circuit and one or more electrical components connected to the circuit. The electrical components and the circuit are at least partially overmolded with a thermoplastic polymer material to encapsulate the components. The material utilized to cover the circuit and/or electrical components may also be utilized to form a housing or other structure of a finished part.
    Type: Grant
    Filed: August 21, 2007
    Date of Patent: March 22, 2011
    Assignee: Innotec Corporation
    Inventors: Thomas J. Veenstra, Paul T. Vander Kuyl, Matthew S. Weeda, Michael L. Lanser, Kyle A. Israels, Jason R. Mulder, Mark W. Vander Pol