Patents by Inventor Mark W. Watson

Mark W. Watson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Assembly and method connecting an aircraft wing aft spar root to an aircraft body fuselage
    Patent number: 11952101
    Abstract: An assembly integrates an aft wing spar root fitting to an aircraft fuselage when joining the aircraft wing to the aircraft body. The assembly provides structural strength to the connection between the aircraft wing and the aircraft body, provides corrosion prevention and provides improved inspection capabilities and repair capabilities to the aircraft wing and aircraft body connection.
    Type: Grant
    Filed: March 3, 2022
    Date of Patent: April 9, 2024
    Assignee: The Boeing Company
    Inventors: Michael R. Rush, Orion P. Watson, Daniel H. Fletcher, Ryan A. Fear, Brent E. Beneke, David H. Leibov, Patricia W. Estell, Norma L Alvarez-Quinones, Soo H. Teoh, Jesse R. Wiseman, Mark E. Shadell, Mark R. Mclaughlin, Emmett A. Salisbury
  • Systems and methods for passive thermal management using phase change material
    Patent number: 8016022
    Abstract: Systems and methods for passive thermal management using phase change material are provided. In one embodiment, a thermal management method is provided. The method comprises securing an electronics assembly to a mounting surface using a thermally insulative support structure; insulating a phase change material within the support structure; and melting the phase change material to reduce heat transfer from an external environment to the electronics assembly during a high temperature transient thermal condition.
    Type: Grant
    Filed: November 27, 2006
    Date of Patent: September 13, 2011
    Assignee: Honeywell International Inc.
    Inventors: Chad E. Richason, Dean R. Hellickson, Mark W. Watson, Allen F. Tuthill
  • Apparatus for electromagentically shielding a portion of a circuit board
    Patent number: 7939766
    Abstract: An apparatus for electrically shielding electronic components is provided. The apparatus includes a circuit board having a first surface with a plurality of electronic components mounted on the first surface, the first surface having a first region and a second region. The circuit board comprises a ground plane and a trace on the first surface coupled to at least one electronic component in the first region and coupled to at least one electronic component in the second region. The circuit board also comprising a strip of conductive material on the first surface, the strip of conductive material forming a perimeter around the first region of the circuit board, the strip of conductive material coupled to the ground plane, the strip of conductive material defining at least one gap wherein the trace is oriented through the at least one gap. Additionally, a first filtering device is coupled to the trace on a first side of the gap.
    Type: Grant
    Filed: January 6, 2009
    Date of Patent: May 10, 2011
    Assignee: Honeywell International Inc.
    Inventors: Robert B. Anderson, Michael A. Gilbert, Mark W. Watson
  • APPARATUS FOR ELECTROMAGENTICALLY SHIELDING A PORTION OF A CIRCUIT BOARD
    Publication number: 20100172115
    Abstract: An apparatus for electrically shielding electronic components is provided. The apparatus includes a circuit board having a first surface with a plurality of electronic components mounted on the first surface, the first surface having a first region and a second region. The circuit board comprises a ground plane and a trace on the first surface coupled to at least one electronic component in the first region and coupled to at least one electronic component in the second region. The circuit board also comprising a strip of conductive material on the first surface, the strip of conductive material forming a perimeter around the first region of the circuit board, the strip of conductive material coupled to the ground plane, the strip of conductive material defining at least one gap wherein the trace is oriented through the at least one gap. Additionally, a first filtering device is coupled to the trace on a first side of the gap.
    Type: Application
    Filed: January 6, 2009
    Publication date: July 8, 2010
    Applicant: HONEYWELL INTERNATIONAL INC.
    Inventors: Robert B. Anderson, Michael A. Gilbert, Mark W. Watson
  • SYSTEMS AND METHODS FOR PASSIVE THERMAL MANAGEMENT USING PHASE CHANGE MATERIAL
    Publication number: 20080121375
    Abstract: Systems and methods for passive thermal management using phase change material are provided. In one embodiment, a thermal management method is provided. The method comprises securing an electronics assembly to a mounting surface using a thermally insulative support structure; insulating a phase change material within the support structure; and melting the phase change material to reduce heat transfer from an external environment to the electronics assembly during a high temperature transient thermal condition.
    Type: Application
    Filed: November 27, 2006
    Publication date: May 29, 2008
    Applicant: Honeywell International Inc.
    Inventors: Chad E. Richason, Dean R. Hellickson, Mark W. Watson, Allen F. Tuthill