Abstract: An electronic device with a housing or enclosure. At least one heat-generating electronic component is contained within the housing. The electronic device further comprises a fan module configured to direct cooling air over the at least one heat-generating electronic component. The fan module is pivotably secured to the housing and capable of pivoting through at least 180°, such that the cooling air can be directed in a front-to-back flow path or a back-to-front flow path. Either of a manufacturer and a customer can reconfigure the direction of airflow.

Abstract: A network device including a module. A chassis supports the module. A lever is secured to an enclosure of the module by a pivot. In one embodiment a pivot axis of the lever is parallel to a major axis of the module. In another embodiment the enclosure includes a clearance through which a portion of a lever from an adjacent module may pass. In another embodiment the lever includes a handle portion and a claw portion. A portion of the handle defines a first plane, the claw defines a second plane, and the first and second planes are parallel and spaced from one another. In another embodiment at least part of the claw portion protrudes outward from an envelope of the module enclosure.

Abstract: One embodiment of the present computer network device comprises a subassembly. The subassembly includes a support plate, a standoff extending from the support plate, a printed circuit board (PCB) secured to the standoff, an electromechanical connector secured to the PCB, an electromagnetic interference (EMI) cage secured to the PCB, and an EMI gasket engaging the EMI cage. The computer network device further comprises a guiding and retaining member that engages the support plate and assists in securing the subassembly within an enclosure. In a method of assembling the computer network device, the subassembly is first assembled before the subassembly is secured within an enclosure. Relative motion of the PCB and the standoffs is thus eliminated during the assembly process.

Abstract: The disclosed embodiments include a plurality of plenums for distributing cooling air throughout the switch. The switch is divided into separate cooling domains. Each PCB receives a separate supply of cooling air, so that no PCB is located upstream or downstream from another PCB. The present embodiments thus eliminate the problem of stack rise, which can decrease switch performance.

Abstract: Card adapter modules and methods for connecting peripheral cards to computing systems are disclosed. The card adapter modules each include a card connector, a peripheral connector, and a housing that supports the card connector and peripheral connector. A peripheral card is connected to a computing system having a chassis with an input/output slot by inserting the peripheral card along a first insertion axis (y-axis) into a card connector of a card adapter module and inserting the card adapter module along a second insertion axis (x-axis) extending through the input/output slot to a platform connector of a computing platform within the computing system. The card connector is electrically connected to the peripheral connector.

Abstract: An apparatus and method are provided for dissipating heat from an electronic component mounted in a conductive enclosure and for shielding electromagnetic radiation generated by the electronic component. A heat sink is configured to be mounted in thermal contact with the electronic component. An electrical conductor is operatively connected to the heat sink and configured to provide electrical contact between the heat sink and a surface of the conductive enclosure, thereby at least partially shielding the electromagnetic radiation generated by the electronic component.

Abstract: An apparatus directs airflow adjacent a circuit board to provide cooling and provides shielding for the circuit board to reduce EMI. The apparatus comprises a barrier for directing airflow and a conductive layer, electrically grounded and physical associated with the barrier, for providing shielding for the circuit board to reduce EMI.

Abstract: A heat sink is provided for transferring heat to air flowing from an upstream path. The heat sink includes a support portion and a plurality of fins extending from the support portion. The fins and the support portion together define channels at least one of which has a portion angled with respect to the upstream path of flowing air. Redirection of the flowing air from the upstream path to at least one downstream path is thereby facilitated.