Patents by Inventor Mark Wendell Schwarz

Mark Wendell Schwarz has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Soldering relief method and semiconductor device employing same
    Patent number: 8841168
    Abstract: A semiconductor device includes a substrate having a first side and a second side, the second side having a mounting location for at least one semiconductor element, and the first side having a plurality of locations electrically connected to locations on the second side. A plurality of electrically conductive interconnects are provided at the locations, each having a first end attached at the location and a second end spaced from the substrate, and an encapsulant partially encapsulates the plurality of interconnects and has a surface lying in a first plane. The second ends are located on the side of the first plane opposite from the substrate first side, an annular space in the encapsulant surrounds each of the plurality of electrically conductive interconnects, and the annular space has a bottom located between the first plane and the substrate first side. Also a method for making such a semiconductor device.
    Type: Grant
    Filed: May 9, 2013
    Date of Patent: September 23, 2014
    Assignee: QUALCOMM Incorporated
    Inventors: Mark Wendell Schwarz, Jianwen Xu
  • SOLDERING RELIEF METHOD AND SEMICONDUCTOR DEVICE EMPLOYING SAME
    Publication number: 20130244384
    Abstract: A semiconductor device includes a substrate having a first side and a second side, the second side having a mounting location for at least one semiconductor element, and the first side having a plurality of locations electrically connected to locations on the second side. A plurality of electrically conductive interconnects are provided at the locations, each having a first end attached at the location and a second end spaced from the substrate, and an encapsulant partially encapsulates the plurality of interconnects and has a surface lying in a first plane. The second ends are located on the side of the first plane opposite from the substrate first side, an annular space in the encapsulant surrounds each of the plurality of electrically conductive interconnects, and the annular space has a bottom located between the first plane and the substrate first side. Also a method for making such a semiconductor device.
    Type: Application
    Filed: May 9, 2013
    Publication date: September 19, 2013
    Applicant: QUALCOMM Incorporated
    Inventors: Mark Wendell Schwarz, Jianwen Xu
  • Soldering relief method and semiconductor device employing same
    Patent number: 8461676
    Abstract: A semiconductor device includes a substrate having a first side and a second side, the second side having a mounting location for at least one semiconductor element, and the first side having a plurality of locations electrically connected to locations on the second side. A plurality of electrically conductive interconnects are provided at the locations, each having a first end attached at the location and a second end spaced from the substrate, and an encapsulant partially encapsulates the plurality of interconnects and has a surface lying in a first plane. The second ends are located on the side of the first plane opposite from the substrate first side, an annular space in the encapsulant surrounds each of the plurality of electrically conductive interconnects, and the annular space has a bottom located between the first plane and the substrate first side. Also a method for making such a semiconductor device.
    Type: Grant
    Filed: September 9, 2011
    Date of Patent: June 11, 2013
    Assignee: QUALCOMM Incorporated
    Inventors: Mark Wendell Schwarz, Jianwen Xu
  • Soldering Relief Method and Semiconductor Device Employing Same
    Publication number: 20130062746
    Abstract: A semiconductor device includes a substrate having a first side and a second side, the second side having a mounting location for at least one semiconductor element, and the first side having a plurality of locations electrically connected to locations on the second side. A plurality of electrically conductive interconnects are provided at the locations, each having a first end attached at the location and a second end spaced from the substrate, and an encapsulant partially encapsulates the plurality of interconnects and has a surface lying in a first plane. The second ends are located on the side of the first plane opposite from the substrate first side, an annular space in the encapsulant surrounds each of the plurality of electrically conductive interconnects, and the annular space has a bottom located between the first plane and the substrate first side. Also a method for making such a semiconductor device.
    Type: Application
    Filed: September 9, 2011
    Publication date: March 14, 2013
    Applicant: QUALCOMM INCORPORATED
    Inventors: Mark Wendell Schwarz, Jianwen Xu