Patents by Inventor Mark Wessel

Mark Wessel has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • High density cabled midplanes and backplanes
    Patent number: 9917392
    Abstract: A cabled midplane includes a first support plate along a plane between a first connector set and a second connector set that connect to line cards on either side of the cabled midplane. The first connector set and the second connector set include connector slices. A wiring sub-layer includes cable slices to provide a connection between the first connector slice of a connector of the first connector set to the first connector slice of a connector of the second connector set, such that the first wiring sub-layer connects each connector of the first connector set, through one cable slice, to a connector of the second connector set. Additional wiring sub-layers are added, and a second support plate, parallel to the first support plate, is provided to encase and support the wiring sub-layers between the first support plate and the second support plate. Other apparatuses and methods are described.
    Type: Grant
    Filed: August 8, 2016
    Date of Patent: March 13, 2018
    Assignee: Intel Corporation
    Inventors: Vladimir Tamarkin, Wayne Genetti, Keith Mease, Mark Wessel
  • HIGH DENSITY CABLED MIDPLANES AND BACKPLANES
    Publication number: 20160352038
    Abstract: A cabled midplane includes a first support plate along a plane between a first connector set and a second connector set that connect to line cards on either side of the cabled midplane. The first connector set and the second connector set include connector slices. A wiring sub-layer includes cable slices to provide a connection between the first connector slice of a connector of the first connector set to the first connector slice of a connector of the second connector set, such that the first wiring sub-layer connects each connector of the first connector set, through one cable slice, to a connector of the second connector set. Additional wiring sub-layers are added, and a second support plate, parallel to the first support plate, is provided to encase and support the wiring sub-layers between the first support plate and the second support plate. Other apparatuses and methods are described.
    Type: Application
    Filed: August 8, 2016
    Publication date: December 1, 2016
    Inventors: Vladimir Tamarkin, Wayne Genetti, Keith Mease, Mark Wessel
  • High density cabled midplanes and backplanes
    Patent number: 9413097
    Abstract: A cabled midplane includes a first support plate along a plane between a first connector set and a second connector set that connect to line cards on either side of the cabled midplane. The first connector set and the second connector set include connector slices. A wiring sub-layer includes cable slices to provide a connection between the first connector slice of a connector of the first connector set to the first connector slice of a connector of the second connector set, such that the first wiring sub-layer connects each connector of the first connector set, through one cable slice, to a connector of the second connector set. Additional wiring sub-layers are added, and a second support plate, parallel to the first support plate, is provided to encase and support the wiring sub-layers between the first support plate and the second support plate. Other apparatuses and methods are described.
    Type: Grant
    Filed: December 22, 2014
    Date of Patent: August 9, 2016
    Assignee: Intel Corporation
    Inventors: Vladimir Tamarkin, Wayne Genetti, Keith Mease, Mark Wessel
  • HIGH DENSITY CABLED MIDPLANES AND BACKPLANES
    Publication number: 20160181719
    Abstract: A cabled midplane includes a first support plate along a plane between a first connector set and a second connector set that connect to line cards on either side of the cabled midplane. The first connector set and the second connector set include connector slices. A wiring sub-layer includes cable slices to provide a connection between the first connector slice of a connector of the first connector set to the first connector slice of a connector of the second connector set, such that the first wiring sub-layer connects each connector of the first connector set, through one cable slice, to a connector of the second connector set. Additional wiring sub-layers are added, and a second support plate, parallel to the first support plate, is provided to encase and support the wiring sub-layers between the first support plate and the second support plate. Other apparatuses and methods are described.
    Type: Application
    Filed: December 22, 2014
    Publication date: June 23, 2016
    Inventors: Vladimir Tamarkin, Wayne Genetti, Keith Mease, Mark Wessel